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Journal of Materials Processing Technology

Volumn 57, Issue 3-4, 1996, Pages 320-331

Plane-strain compression molding analysis of sheet molding compounds in flat and cross-sectional T-shape molds

(3) Jeong, Jin Ho a Kim, Ki Taek b Im, Yong Taek a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

b Samsung Advanced Institute of Technology (SAIT) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CURING; ELECTRIC CHARGE; ELECTRIC CONTACTS; FILLING; FINITE DIFFERENCE METHOD; GLASS FIBERS; HEAT TRANSFER; MOLDS; POLYESTERS; PROCESS CONTROL; SHEET MOLDING COMPOUNDS;

CHARGE DIMENSION; CROSS SECTIONAL T SHAPE MOLDS; PLAIN STRAIN COMPRESSION MOLDING; SHEAR FRICTIONAL CONDITIONS;

COMPRESSION MOLDING;

EID: 0030078875 PISSN: 09240136 EISSN: None Source Type: Journal
DOI: 10.1016/0924-0136(95)02077-2 Document Type: Article

Times cited : (6)

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