A simple formula for the concentration of charge on a three-dimensional corner of a conductor

IEEE Transactions on Microwave Theory and Techniques

Volumn 44, Issue 6, 1996, Pages 975-979

  Zhang, Yimin ^a   Zemanian, A H ^a  

^a BROOKHAVEN NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CAPACITANCE; DIELECTRIC MATERIALS; ELECTRIC CHARGE; FINITE DIFFERENCE METHOD; INTEGRATION; MICROWAVES; PERMITTIVITY; THREE DIMENSIONAL; VLSI CIRCUITS;

MICROWAVE TRANSMISSION; TWO DIMENSIONAL POLAR EXPANSION; VLSI INTERCONNECTION SYSTEM;

ELECTRIC CONDUCTORS;

EID: 0030164261     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.506640     Document Type: Article

References (7)

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3. [3j A. E. Kuehli and P. A. Brennan, "Accurate metallization capacitances for integrated circuits and packages," IEEE J. Solid-State Circuits, vol. SSC-8, pp. 289-290, 1973
4. "Capacitance modals for integrated circuit metallization wires," IEEEJ. Solid-State Circuits, vol. SSC-10, pp. 530-536, 1975
5. A. H. Zemanian. "A finite-difference procedure for the exterior problem inherent in capacitance computations for VLSI interconnections," IEEE Trans. Electron Devices, vol. 35, pp. 985-992, 1988
6. A. H. Zemanian, P. R. Tewarson, C. P. Ju, and J. F. Jen, "Threedimensional capacitance computations for VLS1/ULSI interconnections," IEEE Trans. Computer-aided Design, vol. 8, pp. 1319-1326, 1989
7. Y. Zhang, Three-Dimensional Comer Singularities in VLSI Capacitance Estimation, Ph.D. dissertation, University at Stony Brook, Stony Brook. NY, 1995.