Plastic-encapsulated microcircuit reliability & cost-effectiveness study

IEEE Transactions on Reliability

Volumn 45, Issue 1, 1996, Pages 19-22

  Emerson, Douglas ^a,b   Hakim, Edward ^c,d   Govind, Anand ^d  

^a Rockwell International   (United States)

^b U S ARMY RESEARCH LABORATORY   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

^d Bldg 153264 ^*  (United States)

Author keywords

Plastic encapsulated microcircuit

Indexed keywords

COST EFFECTIVENESS; FAILURE ANALYSIS; INTEGRATED CIRCUIT LAYOUT; MILITARY APPLICATIONS; RELIABILITY;

ASSURANCE TESTING; PLASTIC ENCAPSULATED MICROCIRCUITS;

ELECTRONICS PACKAGING;

EID: 0030107126     PISSN: 00189529     EISSN: None     Source Type: Journal    
DOI: 10.1109/24.488910     Document Type: Article

References (3)

1. Rockwell International, Collins Avionics & Communications Division, ' 'Plastic encapsulated microcircuit (PEM) reliability and cost effectiveness study", Senti-Annual Technical Report, 1995 Apr 27.
2. M. Pecht, L. Ngyuen, E. Hakim, Plastic Encapsulated Microcircuits, 1995; John Wiley & Sons.
3. M. Pecht, R. Agarwal, D. Quearry, "Plastic packaged microcircuits: Quality, reliability, and cost issues", IEEE Trans. Reliability, vof 42, 1993 Dec, pp 513-517.