Plastic Packaged Microcircuits: Quality, Reliability, and Cost Issues

IEEE Transactions on Reliability

Volumn 42, Issue 4, 1993, Pages 513-517

  Pecht, Michael G ^a   Agarwal, Rakesh ^b   Quearry, Dan ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b DELPHI CORPORATION   (United States)

^c Naval Surface Warfare Center ^*  (China)

Author keywords

Plastic encapsulated microcircuit

Indexed keywords

ELECTRIC WIRING; ENCAPSULATION; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; PACKAGING MATERIALS; PLASTIC PRODUCTS; QUALITY ASSURANCE; RELIABILITY; STATISTICAL METHODS; SYSTEMS ANALYSIS;

COST ISSUES; HERMETIC PACKAGE; PLASTIC ENCAPSULATED MICROCIRCUITS; PLASTIC PACKAGED MICROCIRCUITS; THIN SMALL OUTLINE PACKAGES;

ELECTRONICS PACKAGING;

EID: 0027812234     PISSN: 00189529     EISSN: 15581721     Source Type: Journal    
DOI: 10.1109/24.273569     Document Type: Article

References (19)

1. M. Brizoux, et al, “Plastic ICs for military equipment cost reduction challenge and feasibility demonstration”, 40th Electronic Components and Technology Conf., 1990, pp 918-924.
2. L. Condra, S. O'Rear, T. Freedman, et al, “Comparison of plastic and hermetic microcircuits under temperature-humidity-bias”, IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol 15, 1992 Oct, pp 640-650.
3. L. Condra, M. Pecht, “Options for commercial microcircuits in avionic products”, Defense Electronics, 1991 Jul, pp 43-46.
4. J.T. Flood, “Reliability aspects of plastic encapsulated integrated circuits”, Proc. Int'l Reliability Physics Symp., 1972, pp 95-99.
5. K.C. Grigg, “Plastic versus ceramic IC reliability study”, Report No. WP86-2020, 1986 Jul 10; Rockwell Int'l, Collins Group.
6. Intel Corporation, Packaging, A Handbook, Intel 240800, 1993, pp 4-2 and 4-3.
7. B.E. Kurtz, “Implications of non-hermetic chip packaging for military electronics”, 1990 Int'l Packaging Conf., 1990 Sep, pp 848-857.
8. C.A. Lidback, “Plastic encapsulated products vs Hermetically sealed products”, Summary Report, 1987 Jan; Motorola Inc., Govt. Eilectronics Group.
9. Plastic Package Reliability Report, Bipolar Integrated Circuits, 1974; I/C Reliability Engineering Dept., Motorola.
10. M. Priore, J. Farrell, “Plastic microcircuit packages: A technology review”, Rept. CRTA-PEM, 1992 Mar; Reliability Analysis Center, Rome, NY.
11. “IC quality grades: Impact on system reliability and life cycle cost”, Report SOARS, 1985; Rome Laboratory, Reliability Analysis Center.
12. R.J. Straub, “Automotive electronic IC reliability”, Proc. Custom Integrated Circuit Conf., 1990, pp 92-94.
13. Texas Instruments Military Plastic Packaging, Preliminary Handbook, 1992; Texas Instruments.
14. L.R. Villalobos, “Reliability of plastic integrated circuits in military applications”, ESPReportNo. PV 620-0530-1, 1989 Jan 04; Motorola Govt. Electronics Group, Tactical Electronics Div.
15. G.F. Watson, “Plastic-packaged ICs in military equipment”, IEEE Spectrum 1991 Feb, pp 62-63.
16. Policy Directive on ARSR-4 Microcircuit Review, 1991 Aug; Westinghouse Report.
17. N. Sinnadurrai, “Advances in microelectronics packaging and interconnection technologies - Toward a new hybrid microelectronics, Microelectronics J., vol 16, num 5, 1985, pp 333-333.
18. M. Pecht, V. Ramappan, “Are components still the major problem: A review of electronic systems and device field failure returns”, IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol 15. 1992 Dec, pp 1160-1164.
19. Correspondence with Steve Bakke at Alliant Techsystems Inc., 1993 Dec.