High stability solderless junctions using advanced conductive adhesives

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 1, Issue , 1991, Pages 193-212

  Gilleo, K ^a   Chu, A L ^a   Vieau, D ^a  

^a Poly Flex Circuits   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES - ELECTRIC CONDUCTIVITY; INTEGRATED CIRCUIT MANUFACTURE;

CONDUCTIVE ADHESIVES; SOLDERLESS JUNCTIONS;

ELECTRONICS PACKAGING;

EID: 0025745617     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (46)