Separation of film thickness and grain boundary strengthening effects in Al thin films on Si

Journal of Materials Research

Volumn 7, Issue 8, 1992, Pages 2040-2048

  Venkatraman, Ramnath ^a   Bravman, John C ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM AND ALLOYS - STRENGTHENING; METALS AND ALLOYS - GRAIN BOUNDARIES; METALS AND ALLOYS - GRAIN SIZE AND SHAPE; SILICON AND ALLOYS - COATINGS; STRESSES - MEASUREMENTS;

ANODIC OXIDE BARRIER; FILM THICKNESS; GRAIN BOUNDARY STRENGTHENING; STRESS VARIATIONS;

ALUMINUM AND ALLOYS;

EID: 0026903429     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/JMR.1992.2040     Document Type: Article

References (29)

1. A.K. Sinha and T.T. Sheng, Thin Solid Films 48, 117 (1978).
2. M. Hershkovitz, I. A. Blech, and Y. Komem, Thin Solid Films 130, 87 (1985).
3. V. M. Koleshko, V. F. Belitsky, and I.V. Kiryushin, Thin Solid Films 142, 199 (1986).
4. P. A. Flinn, D. S. Gardner, and W. D. Nix, IEEE Trans. Electron Dev. ED-34, 689 (1987).
5. M.F. Doerner and W.D. Nix, in CRC Critical Reviews in Solid State and Materials Sciences (CRC Press, Cleveland, OH, 1988), Vol. 14, p. 225.
6. F. R. Brotzen, C. T. Rosemayer, and R. J. Gale, Thin Solid Films 166, 291 (1988).
7. D. S. Gardner and P. A. Flinn, IEEE Trans Electron Dev. 35, 2160 (1988).
8. D. S. Gardner and P. A. Flinn, in Thin Films: Stresses and Mechanical Properties, edited by J. C. Bravman, W. D. Nix, D. M. Barnett, and D.A. Smith (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 69.
9. W.D. Nix, Metall. Trans. A 20A, 2217 (1989).
10. R. Venkatraman, P. W. Davies, P.A. Flinn, D.B. Fraser, J. C. Bravman, and W. D. Nix, J. Electron Mater. 19, 1231 (1990).
11. R. Venkatraman, S. Chen, and J. C. Bravman, J. Vac. Sci. Technol. A 9, 2536 (1991).
12. M. Murakami, Thin Solid Films 59, 105 (1979).
13. P. Chaudhari, Philos. Mag. 39, 507 (1979).
14. M. A. Meyers and K. K. Chawla, Mechanical Metallurgy (Prentice Hall Inc., Englewood Cliffs, NJ, 1984).
15. A. J. Griffin, Jr., F. R. Brotzen, and C. F. Dunn, Thin Solid Films 150, 237 (1987).
16. A.J. Griffin, Jr., F. R. Brotzen, and C. Dunn, Scripta Metall. 20, 1271 (1986).
17. W. W. Mullins and P.G. Shewmon, Acta Metall. 7, 163 (1959).
18. C. V. Thompson, in Annual Review of Materials Science (Annual Review Inc., 1990), p. 245.
19. C. A. Ross, J. S. Drewery, R. E. Somekh, and J. E. Evetts, J. Appl. Phys. 66, 2349 (1989).
20. L. Young, Anodic Oxide Films (Academic Press, New York, 1961), Chap. 16.
21. G. C. Schwartz and V. Platter, J. Electrochem. Soc. 122, 1508 (1975).
22. P. H. Townsend, D. M. Barnett, and T.A. Brunner, J. Appl. Phys. 62, 4438 (1987).
23. M.F. Doerner, D.S. Gardner, and W.D. Nix, J. Mater. Res. 1, 845 (1986).
24. G. E. Dieter, Mechanical Metallurgy (McGraw-Hill Book Co., New York, 1986).
25. A. D. Romig, Jr., D. R. Frear, and T.J. Headley, in Proceedings of the 47th Annual Meeting of the Electron Microscopy Society of America (1989), p. 216.
26. D. R. Frear, J. E. Sanchez, A. D. Romig, Jr., and J. W. Morris, Jr., Metall. Trans A. 21A, 2449 (1990).
27. C.J. Chute and J.B. Cohen, J. Mater. Res. 6, 950 (1991).
28. Private communication with Dr. W. D. Nix, Stanford University.
29. R. Venkatraman, P. R. Besser, S. Brennan, and J. C. Bravman, in Thin Films: Stresses and Mechanical Properties III, edited W. D. Nix, J. C. Bravman, E. Arzt, and L. B. Freund (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992).