Electrical Properties of Giant-Grain Copper Thin Films Formed by a Low Kinetic Energy Particle Process

Journal of the Electrochemical Society

Volumn 139, Issue 3, 1992, Pages 922-927

  Ohmi, Tadahiro ^b   Otsuki, Masahito ^b   Takewaki, Toshiyuki ^b   Shibata, Tadashi ^b  

^a HITACHI LTD   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TREATMENT - ANNEALING; KINETICS; METALLIC FILMS - ELECTRIC PROPERTIES; METALLOGRAPHY - GRAIN SIZE AND SHAPE;

GIANT GRAIN COPPER; LOW KINETIC ENERGY PARTICLE PROCESS;

COPPER AND ALLOYS;

EID: 0026834671     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2069326     Document Type: Article

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