Copper interconnection with tungsten cladding for ULSI

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1991, Pages 39-40

  Cho, J S H ^a   Kang, H K ^a   Beiley, M A ^a   Wong, S S ^a   Ting, C H ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COPPER AND ALLOYS--CHEMICAL VAPOR DEPOSITION; INTEGRATED CIRCUITS, CMOS--FABRICATION; TUNGSTEN AND ALLOYS--CHEMICAL VAPOR DEPOSITION;

BICMOS PROCESS; COPPER INTERCONNECTIONS; TUNGSTEN CLADDING;

INTEGRATED CIRCUITS, ULSI;

EID: 0026370261     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)