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1
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0000843947
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Two Distinct Interface Trap Peaks in Radiation Damaged Metal/SiO2/Si Structures
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E. F. daSilva, Y. Nishioka, and T.P. Ma, “Two Distinct Interface Trap Peaks in Radiation Damaged Metal/SiO2/Si Structures,” Appl. Phys. Lett. 51, 270 (1987).
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daSilva, E.F.1
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Ma, T.P.3
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2
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0025682742
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Post-Irradiation Irradiation Behavior of the Interface State Density and the Trapped Positive Charge
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R.E. Stahlbush, B. J. Mrstik, and R. K. Lawrence, “Post-Irradiation Irradiation Behavior of the Interface State Density and the Trapped Positive Charge,” IEEE Trans. Nucl. Sci, NS-37, 1641 (1990).
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Stahlbush, R.E.1
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3
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0024891798
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Orientation Dependence of Interface-Trap Transformation
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Y. Wang, T.-P. Ma, and R. C. Barker, “Orientation Dependence of Interface-Trap Transformation,” IEEE Trans. Nucl. Sci. NS-36, 1784 (1989).
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IEEE Trans. Nucl. Sci.
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Wang, Y.1
Ma, T.-P.2
Barker, R.C.3
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4
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0024169717
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Annealing of Total Dose Damage: Redistribution of Interface States Density on <100>, <110> and <111> Orientation Silicon
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R. E. Stahlbush, R. K. Lawrence, H. L. Hughes, and N. S. Saks, “Annealing of Total Dose Damage: Redistribution of Interface States Density on <100>, <110> and <111> Orientation Silicon,” IEEE Trans. Nucl. Sci. NS-35, 1192 (1988).
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Stahlbush, R.E.1
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Saks, N.S.4
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5
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0024900213
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Reliability of MOSFETs as Affected by the Interface Trap Transformation Process
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E. F. daSilva, Jr., Y. Nishioka, M. Kato, and T.-P. Ma, “Reliability of MOSFETs as Affected by the Interface Trap Transformation Process,” IEEE Electron Device Lett., EDL-10, 10, 537 (1989).
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daSilva, E.F.1
Nishioka, Y.2
Kato, M.3
Ma, T.-P.4
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6
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0019074649
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RF Annealing Mechanisms in Metal-Oxide-Semiconductor Structures -an Experimental Simulation
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T.-P. Ma, M. R. Chin, “RF Annealing Mechanisms in Metal-Oxide-Semiconductor Structures -an Experimental Simulation,” J. Appl. Phys. 51(10), pp. 5458–5463(1980).
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J. Appl. Phys.
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Ma, T.-P.1
Chin, M.R.2
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7
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0019680088
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The Effect of Test Conditions on MOS Radiation-Hardness Results
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P. V. Dressendorfer, J. M. Soden, J. J. Harrington, and T. V. Nordstorm, “The Effect of Test Conditions on MOS Radiation-Hardness Results,” IEEE Trans. Nucl. Sci., vol. NS-28, pp. 4281–4287(1981).
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Dressendorfer, P.V.1
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Nordstorm, T.V.4
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8
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0344690219
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The Effects of Operating Frequency in the Radiation Induced Buildup of Trapped Holes and Interface States in MOS Devices
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T. Stanley, D. Neamen, P. Dressendorfer, J. Schwank, P. Winokur, M. Ackerman, K. Jungling, C. Hawkins, and W. Grannemann, “The Effects of Operating Frequency in the Radiation Induced Buildup of Trapped Holes and Interface States in MOS Devices,” IEEE Trans. on Nucl. Sci., vol. NS-32, pp. 3982–3987(1985).
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Stanley, T.1
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Ackerman, M.6
Jungling, K.7
Hawkins, C.8
Grannemann, W.9
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9
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0025682740
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Predicting Switched-Bias Response from Steady-State Irradiations
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D. M. Fleetwood, P. S. Winokur, and L. C. Riewe, “Predicting Switched-Bias Response from Steady-State Irradiations,” IEEE Trans. on Nucl. Sci., vol. NS-37, pp. 1806–1817 (1990).
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Fleetwood, D.M.1
Winokur, P.S.2
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10
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0024168776
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Using Laboratory X-ray and Cobalt-60 Irradiations to Predict CMOS Device Response in Strategic and Space Environments
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D. M. Fleetwood, P. S. Winokur, and J. R. Schwank, “Using Laboratory X-ray and Cobalt-60 Irradiations to Predict CMOS Device Response in Strategic and Space Environments,” IEEE Trans. on Nucl. Sci., vol. NS-35, pp. 1497–1505 (1988).
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Fleetwood, D.M.1
Winokur, P.S.2
Schwank, J.R.3
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11
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0025592885
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High-Frequency Annealing Effects on Ionizing Radiation Response of MOSFET
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T. Okabe, M. Kato, M. Katueda, H. Kamimura, and I. Takei, “High-Frequency Annealing Effects on Ionizing Radiation Response of MOSFET,” IEEE Trans. Nucl. Sci. NS-37, 1670 (1990).
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Okabe, T.1
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Kamimura, H.4
Takei, I.5
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12
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0024917492
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Radiation Effects on UHF Power MOSFETs
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T. Okabe, M. Kato, M. Katueda, I. Takei, and M Ikeda “Radiation Effects on UHF Power MOSFETs,” IEEE Trans. Nucl. Sci. NS-36, 2110 (1989).
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Okabe, T.1
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Ikeda, M.5
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13
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0024913722
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The Nature of the Trapped Hole Annealing Process
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A. J. Lelis, T. R. Oldham, H. E. Boesch, Jr., F. B. McLean, “The Nature of the Trapped Hole Annealing Process,” IEEE Trans. Nucl. Sci. NS-36, 1808 (1989).
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Lelis, A.J.1
Oldham, T.R.2
Boesch, H.E.3
McLean, F.B.4
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14
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0021201529
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A Reliable Approach to Charge-Pumping Measurements in MOS Transistors
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G. Groeseneken, H. E. Maes, N. Beltran, and R. F. de Keersmaecker, “A Reliable Approach to Charge-Pumping Measurements in MOS Transistors,” IEEE Trans. Electron Devices ED-31, 42 (1984).
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Groeseneken, G.1
Maes, H.E.2
Beltran, N.3
de Keersmaecker, R.F.4
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16
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0018036428
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Recombination Enhanced Defect Reactions
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L. C. Kimeling, “Recombination Enhanced Defect Reactions,” Solid-State Electronics, vol. 21, pp. 1391–1401 (1978).
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Kimeling, L.C.1
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