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Effect of interconnection scaling on time delay of VLSI circuits
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K. C. Saraswat and F. Mohammadi “Effect of interconnection scaling on time delay of VLSI circuits,” IEEE Trans. Electron Devices, vol. ED-29, pp. 645–650, Apr. 1982.
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IEEE Trans. Electron Devices
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Saraswat, K.C.1
Mohammadi, F.2
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2
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The evolution of digital electronics towards VLSI
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IEEE Trans. Electron Devices
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Keyes, R.W.1
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Speed limitations due to interconnect time constants in VLSI integrated circuits
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A. K. Sinha, J. A. Cooper, Jr., and H. J. Levinstein “Speed limitations due to interconnect time constants in VLSI integrated circuits,” IEEE Electron Device Lett., vol. EDL-3, pp. 90–92, Apr. 1982.
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Sinha, A.K.1
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1-µ m MOSFET VLSI technology. Part VII: Metal silicide interconnection technology-a future perspective
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B. L. Crowder and S. Zirinsky, “1-µ m MOSFET VLSI technology. Part VII: Metal silicide interconnection technology-a future perspective,” IEEE Trans. Electron Devices, vol. ED-26, pp. 369–371, 1979.
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Crowder, B.L.1
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Properties of sputtered tungsten silicide for MOS integrated circuit applications
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F. Mohammadi and K. C. Saraswat “Properties of sputtered tungsten silicide for MOS integrated circuit applications,” J. Electrochem. Soc., vol. 127, pp. 450–454, 1980.
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J. Electrochem. Soc.
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Mohammadi, F.1
Saraswat, K.C.2
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6
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Composite silicide gate electrodes–interconnections for VLSI device technologies
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H. Geipel, Jr., N. Hsieh, N. H. Ishaq, C. W. Koburger, and F. R. White, “Composite silicide gate electrodes–interconnections for VLSI device technologies,” IEEE Trans. Electron Devices, vol. ED-27, pp. 1417–1424, 1980.
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Koburger, C.W.4
White, F.R.5
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7
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0019048872
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Film pioperties of MoSi2 and their application to self-aligned MoSi2 gate MOSFET
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T. Mochizuki, T. Tsujimaru, M. Kashiwagi, and Y. Nishi “Film pioperties of MoSi2 and their application to self-aligned MoSi2 gate MOSFET,” IEEE Trans. Electron Devices, vol. ED-27, pp. 1431–1435, 1980.
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Mochizuki, T.1
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8
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0019049138
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MOS compatibility of high-conductivity TaSi2/N+ poly-Si gates
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A. K. Sinha, W. S. Lindenberger, D. B. Fraser, S. P. Murarka, and E. N. Fuls “MOS compatibility of high-conductivity TaSi2/N+ poly-Si gates,” IEEE Trans. Electron Devices, vol. ED-27, pp. 1425–1430, 1980.
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Sinha, A.K.1
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Fraser, D.B.3
Murarka, S.P.4
Fuls, E.N.5
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9
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0019045587
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Refractory silicides of titanium and tantalum for low-resistivity gates and interconnects
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S. P. Murarka., D. B. Fraser, A. K. Sinha, and H. J. Levinstein “Refractory silicides of titanium and tantalum for low-resistivity gates and interconnects,” IEEE Trans. Electron Devices, vol. ED-27, pp. 1409–1417, 1980.
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Murarka, S.P.1
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11
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Material properties of silicides and device technology implications
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C. DellOca and W. M. Bullis, Eds. The Electrochemical Society
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F. M. d'Heurle, “Material properties of silicides and device technology implications,” in VLSI Science and Technology/1982, C. Dell'Oca and W. M. Bullis, Eds. The Electrochemical Society, 1982, pp. 194–212.
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d'Heurle, F.M.1
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12
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84956267326
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A new MOS process using MoSi2 as a gate material
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T. Mochizuki, K. Shibata, T. Inoue, and K. Ohuchi “A new MOS process using MoSi2 as a gate material,” Japan. J. Appl. Phys., suppl., vol. 17, pp. 37–42, 1977.
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13
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0010643153
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Studies of steam-oxidized WSi2 by Auger sputter profiling
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J. Rouse, F. Mohammadi, C. R. Helms, and K. C. Saraswat, “Studies of steam-oxidized WSi2 by Auger sputter profiling,” Appl. Phys. Lett., vol. 37, pp. 305–307, 1980.
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Appl. Phys. Lett.
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0020737502
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Properties of sputtered molybdenum silicide thin films
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T. P. Chow, D. H. Bower, R. L. VanArt, and W. Katz “Properties of sputtered molybdenum silicide thin films,” J. Electrochem. Soc., vol. 130, pp. 952–956, 1983.
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Chow, T.P.1
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Reaction kinetics of tungsten thin flims on silicon (100) surface
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L. D. Locker and C. D. Capio, “Reaction kinetics of tungsten thin flims on silicon (100) surface,” J. Appl. Phys., vol. 44, pp. 4366–4369, 1973.
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Locker, L.D.1
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T. Shibata, T. W. Sigmon, J. L. Regolini, and J. F. Gibbons, “Metal silicon reactions induced by CW scanned laser and electron beams,” J. Electrochem. Soc., vol. 128, pp. 637–644, 1981.
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Shibata, T.1
Sigmon, T.W.2
Regolini, J.L.3
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0019082568
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Observations on the hexagonal form of MoSi2 and WSi2 films produced by ion implantation and on related snowplow effects
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F. M. d'Heurle, C. S. Petersson, and M. Y. Tsai “Observations on the hexagonal form of MoSi2 and WSi2 films produced by ion implantation and on related snowplow effects,” J. Appl. Phys., vol. 51, pp. 5976–5980, 1980.
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d'Heurle, F.M.1
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Low temperature CVD growth of tungsten disilicide
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The Electrochemical Society
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W. I. Lehrer and J. M. Pierce, “Low temperature CVD growth of tungsten disilicide,” in Semiconductor Silicon 1981, vol. 81-5. The Electrochemical Society, 1981, pp. 588–595.
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Semiconductor Silicon 1981
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Lehrer, W.I.1
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A CVD study of the tungsten silicon system
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J. S. Lo, R. W. Haskell, J. G. Byrne, and A. SoSin, “A CVD study of the tungsten silicon system,” in Proc. 4th CVD Int. Conf., pp. 74–90, 1973.
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CVD of silicides of Mo, Nb and Ta
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Low temperature LPCVD deposition of tantalum suicide
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The Electrochemical Society
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W. I. Lehrer, J. M. Pierce, E. Goo, and S. Justi, “Low temperature LPCVD deposition of tantalum suicide,” in VLSI Science and Technology/1982, vol. 82-7. The Electrochemical Society, pp. 258–264.
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VLSI Science and Technology/1982
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Lehrer, W.I.1
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Properties of low pressure CVD tungsten silicide as related to IC process requirements
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D. L. Brors, J. A. Fair, K. A. Monnig, K. C. Saraswat “Properties of low pressure CVD tungsten silicide as related to IC process requirements,” Solid State Technol., vol. 26, pp. 183–186, 1983.
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Brors, D.L.1
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Properties of molybdenum silicide film deposited by chemical vapor deposition
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S. Inoue, N. Toyokura, T. Nakamura “Properties of molybdenum silicide film deposited by chemical vapor deposition,” J. Electrochem. Soc., vol. 130, pp. 1603–1607, 1983.
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25
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Deposition parameters and characteristics of low pressure CVD tungsten silicide
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to be published
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K. A. Moning, J. A. Fair, D. L. Brors, K. C. Saraswat, “Deposition parameters and characteristics of low pressure CVD tungsten silicide,” J. Electrochem. Soc., to be published.
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J. Electrochem. Soc.
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Moning, K.A.1
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Properties of tungsten silicide film on polycrystalline silicon
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M. Y. Tsai, F. M. d'Heurle, C. S. Petersson, and R. W. Jonson “Properties of tungsten silicide film on polycrystalline silicon,” J. Appl. Phys., vol. 52, pp. 5350, 1981.
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0346609000
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Kinetics of thermal oxidation of WSi2
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F. Mohammadi, K. C. Saraswat, and J. D. Meindl “Kinetics of thermal oxidation of WSi2,” Appl. Phys. Lett., vol. 35, no. 7, pp. 529–531, 1975.
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Interface effects in the formation of silicon oxide on metal silicide layers over silicon substrates
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J. E. E. Baglin, F. M. d'Heurle, and C. S. Peterson, “Interface effects in the formation of silicon oxide on metal silicide layers over silicon substrates,” J. Appl. Phys., vol. 54, no. 4, p. 1849, 1983.
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A model for thermal oxidation of refractory silicides
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L. Lie, W. Tiller, and K. C. Saraswat, “A model for thermal oxidation of refractory silicides,” J. Appl. Phys., to be published.
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