Finishing characteristics of ELID-lap using ultra fine grain lapping wheel

International Journal of the Japan Society for Precision Engineering

Volumn 30, Issue 4, 1996, Pages 305-310

  Itoh, Nobuhide ^a   Ohmori, Hitoshi ^b  

^a IBARAKI UNIVERSITY   (Japan)

^b INST OF PHYS AND CHEMICAL RESEARCH   (Japan)

Author keywords

Ductile mode grinding; Electrolytic in process dressing (elid); Grinding characteristics; Lap grinding; Metal resin bonded lapping wheel; Removal mechanism

Indexed keywords

EID: 0013449297     PISSN: 0916782X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. H.Ohmori and T.Nakagawa; Mirror Surface Grinding of Silicon Wafer using ELID, Annals of the CIRP Vol 39/1, 329
2. H.Ohmori; Finishing Process by Using Bonded Abrasive Hybrid Lapping (3rd), Preprint for Autumn Conf. of JSPE, 1988, 203 (in Japanese)
3. N.Itoh and H.Ohmori; Grinding Characteristics of Metal-Resin Diamond Wheel with ELID for Hard and Brittle Materials, Proceedings of the 2nd International Conf., 1995, 471
4. H.Ohmori; ELID Grinding by Using Ultra Fine Grain Lapping Wheel, Proceedings of JSGE, 1993, 5 (in Japanese)
5. N.Itoh and H.Ohmori; ELID-lap Grinding Using Metal-resin Bonded Lapping Wheel (3rd), Preprint for Autumn Conf. of JSPE, 1995, 155 (in Japanese)
6. N.Itoh and H.Ohmori; AFM Photographs of Ground Surface by ELID-lap Grinding, Preprint for Spring Conf. of JSPE, 1995, 673 (in Japanese)