SCOPUS 정보 검색 플랫폼

Volumn 39, Issue 1, 1990, Pages 329-332

Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing

a INSTITUTE OF INDUSTRIAL SCIENCE (Japan)

Author keywords

ductile regime grinding; east iron fiber bonded wheel; electrolytic in process dressing; micro grain wheel; mirror surface grinding; nano grinding; silicon wafer

Indexed keywords

EID: 58149208117 PISSN: 00078506 EISSN: 17260604 Source Type: Journal
DOI: 10.1016/S0007-8506(07)61065-8 Document Type: Article

Times cited : (348)

References (8)

1
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- H. Ohmor i, T. Nakagawa. 987, Grinding of silicon using cast iron fiber bonded wheel (3rd report), Preprint of Autumn Conf. of JSPE, 887-688

2
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- H. Ohmor i, T. Nakagawa. 1988, Grinding of silicon using cast iron fiber bonded wheel (4th report), Preprint of Spring Conf. of JSPE, 521-522

3
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- H. Ohmor i, K. Toyama, T. Nakagawa, 1988, Grinding of silicon using CIFB -D wheel (5th report), Preprint of Autumn Conf. of JSPE, 716-718

4
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- H. Ohmor i, K. Toyama, T. Nakagawa, 1989. Grinding of silicon using CIFB -D wheel (6th report), Preprint of Spring Conf. of JSPE, 365-366

5
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- H. Ohmori, T. Nakagara, 1889, Grinding technique using submicrograin wheel, Preprint of Autumn Conf. of JSPE, 903-904

6
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- H. Ohmor i, S. kurosawa, T. Nakagawa, 1989, Elid-grinding of glasses using electro-plated wheel, Preprint of Spring Conf. of JSPL, 373-374

7
- 84914263185
- H. Ohmor i, T. Nakagawa, 1989, Electrolytic Dressing technique of Bronze Bonded wheel, Preprint of Autumn Conf. of JSPE, 321-322

8
- 84914263184
- I. Takahash i, H. Ohmor i, T. Nakagawa, 1988, Highly efficient grinding of hard and brittle materials, Preprint of Autumn Conf. of JSPE, 401-402

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.