Calibration Technique for MCT FPA Used for Backside Emission Microscopy

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2001, Pages 161-165

  Weizman, Yoav ^a   Shperber, Shai ^a   Baruch, Ezra ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP-CHIP PACKAGING; INFRARED FOCAL PLANE ARRAYS (IR FPA);

CALIBRATION; CHARGE COUPLED DEVICES; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; EMISSION SPECTROSCOPY; FAILURE ANALYSIS; FLIP CHIP DEVICES; MAGNESIUM COMPOUNDS; PHOTONS; TRANSISTORS;

INTEGRATED CIRCUITS;

EID: 0013288209     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. T.W Joseph, A.L. Berry and B. Bossmann, ISTFA, 1992, pp. 1-7
2. C.L Chiang., N. Khurana, D. Hurley and K. Teasdale, ISTFA 1998, pp. 447-453.
3. B. Davis and W. Chi, ISTFA 2000, pp. 155-160
4. B. Davis, ISTFA 2000, pp. 173-176
5. P.A. Child, R.A. Straut and W. Eccleston, Solid state Elect. 1985, 26, p.685-688
6. Tsuchiya and Nakjima, IEEE Trans. Elect. Dev. ED-32, 1985, p. 405
7. J. Klzer, C. Boit, A. Dallmann, G. Deboy, J. Otto, D. Weinmann, J. Appl. Phys. 71(11), 1 June 1992, p. R23