J-lead solder joint thermal fatigue life model

American Society of Mechanical Engineers (Paper)

Volumn , Issue , 1997, Pages

  Wong, T E ^a   Kachatorian, L A ^a   Cohen, H M ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED ANALYSIS; CRACK INITIATION; CRACK PROPAGATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; THERMAL CYCLING;

MANSON COFFIN FATIGUE LIFE PREDICTION THEORY; SOFTWARE PACKAGE ABAQUS;

SOLDERED JOINTS;

EID: 0031372570     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)