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Volumn 1, Issue 2, 2001, Pages 113-122

A haptic assembly and disassembly simulation environment and associated computational load optimization techniques

Author keywords

Design for Assembly; Design for Disassembly; Haptic interfaces; Haptics; Virtual prototyping

Indexed keywords


EID: 0012934525     PISSN: 15309827     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1389085     Document Type: Article
Times cited : (60)

References (26)
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    • Hardwick, A.1    Furner, S.2    Rush, J.3
  • 12
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    • Cognitive Spaces and Metaphors: A Solution for Interaction With Spatial Data
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    • Neves, N.1    Silva, J.P.2    Goncalves, P.3    Muchaxo, J.4    Silva, J.M.5    Camara, A.6
  • 15
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    • Application of Robust Control for Elastic Joint Robots
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    • Evaluation of Position and Orientation Increment Methods for Teleoperation
    • New Orleans, LA
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    • Sheffield, J.1    Chan, T.F.2    Dubey, R.V.3    Kress, R.L.4
  • 17
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    • CGI 2000: The 18th Computer Graphics International ‘Humans and Nature’ Conference, Geneva, Switzerland
    • Burdea, G., 2000, “Haptics Issues in Virtual Environments,” CGI 2000: The 18th Computer Graphics International ‘Humans and Nature’ Conference, Geneva, Switzerland.
    • (2000) Haptics Issues in Virtual Environments
    • Burdea, G.1
  • 20
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    • Prototyping and Design for Assembly Analysis Using Multimodal Virtual Environment
    • Gupta, R., Whitney, D., and Zeltzer, D., 1997, “Prototyping and Design for Assembly Analysis Using Multimodal Virtual Environment,” Comput.-Aided Des., 29, pp. 585-597.
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  • 26
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    • Haptics in Virtual Environments: Taxonomy, Research Status, and Challenges
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    • Srinivasan, M.A.1    Basdogan, C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.