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Volumn 19, Issue 11, 1996, Pages
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Optimized backgrind wafer process minimizes stress effects
a a a a
a
IBM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
CAPACITANCE MEASUREMENT;
CRACKS;
GRINDING (MACHINING);
PROCESS CONTROL;
RESIDUAL STRESSES;
SILICON WAFERS;
BACKGRINDED WAFER;
NON CONTACT CAPACITANCE TECHNOLOGY;
NONUNIFORMITIES;
UNIFORMITY;
YIELD LOSS;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0030270778
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (2)
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References (3)
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