Multilayer multichip modules for microwave and millimeterwave integration

1998 28th European Microwave Conference, EuMC 1998

Volumn 2, Issue , 1998, Pages 443-448

  Mangold, T ^a   Wolf, J ^b   Topper, M ^b   Reichl, H ^b   Russer, P ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

MULTICHIP MODULES; MULTILAYERS;

DIELECTRIC POLYMERS; EQUIVALENT CIRCUIT MODEL; FULL-WAVE MODEL; HIGH FREQUENCY PERFORMANCE; INTERLEVEL DIELECTRIC; MICROWAVE AND MILLIMETERWAVE; PLANAR INTEGRATIONS; THIN FILM MULTILAYERS;

FILM PREPARATION;

EID: 0012720096     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.1998.338194     Document Type: Conference Paper

References (8)

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3. J. Wolf, F.J. Schmiickle, et al. System integration for high frequency applications. In Proceedings ISHM 97, Philadelphia, October 1997
4. M. Thpper and J. Wolf. MCM-D with embedded active and passive components. In Proceedings ISHMC 96, Minneapolis, October 1996
5. P.B. Johns. A symmetrical condesnsed node for the tlm method. IEEE Trans. Microwave Theory Tech, 35:370-377, 1987
6. B. Isele and P. Russer. Improved skin effect model in TLM. In COMPUMAG, Miami, Florida, 31. Oktober-4. November 1993
7. J. Rebel and P. Russert Modelling, of dispersive media in TLM using the propagator approach. In Proc. ACES, volume 1, pages 336-343, 1998
8. T. Mangold and P. Russer. Generation of lumped element equivalent circuits from time-domain scattering signals. In Proc. ACES, volume 1, pages 351-358, March 1998