Underlayered and multilayered electrodeposits

Metal Finishing

Volumn 100, Issue 4, 2002, Pages 18-27

  Gabe, D R ^a   Wilcox, G D ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CHROMIUM PLATING; COATINGS; CRACKING (CHEMICAL); DISLOCATIONS (CRYSTALS); GALVANIZING; GOLD; MULTILAYERS; POROSITY; SPRAYING; STEEL; SURFACE ROUGHNESS; THIN FILMS; WEAR RESISTANCE; ZINC;

COMPOSITIONALLY MODULATED ALLOY (CMA); DUPLEX COATINGS; ELECTROCHEMICAL MODELING; ZINCATE PROCESS;

ELECTRODEPOSITION;

EID: 0012690525     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-0576(02)80242-2     Document Type: Review

References (44)

1. Dennis, J.K and T.E. Such, "Nickel and Chromium Plating," 3rd Ed., p, 270, Woodhead Pub., Cambridge, U.K.; 1993
2. Brown, H. and D.R. Millage, Trans. IMF, 37:21; 1960
3. Flint, G.N. and S.H. Melbourne, Trans. IMF, 38:35; 1961,
4. Flint, G.N. and S.H. Melbourne, Trans. IMF, 38 and 39:85; 1962
5. Edwards, J. and V.E. Carter, Trans. IMF, 39:142; 1962
6. Dennis, J.K and T.E. Such, Trans. IMF, 40:60; 1963
7. Flint, G.N., Trans. IMF, 40:98; 1963
8. du Rose, A.H., Trans. IMF, 41:59; 1964
9. Nobel, F.I. et al., Plating, 52(10):1001-8; 1965
10. Clarke, M. and J.M. Leeds, Trans. IMF, 43:50, 1965
11. Garte, S.M., Plating, 55:946; 1968
12. Gabe, D.R., Electrochim Acta, 39:115; 1994
13. Gabe, D.R., J. Korean Inst. Surf. Eng., 32:195; 1999
14. Blum, W., Trans. Am. Electrochem. Soc., 40:307; 1921
15. Brenner, A., "Electrodeposition of Alloys," Vol. 2, p. 589, Academic Press, New York; 1963
16. Koehler, J.S., Phys. Rev. B, 2:547; 1970
17. Cohen, U. et al., J. Electrochem. Soc., 130:1937; 1983
18. Tench, D. and J. White, Met. Trans. A, 15:2039; 1984
19. Yahalom, J. and O. Zadok, J. Mat. Sci., 22:499; 1987
20. Baral, D. et al., J. Appl. Phys., 57:1076; 1985
21. Ogden, C., Plating and Surface Finishing, 73(5):130; 1986
22. Tench, D.M. and J.T. White, J. Electrochem. Soc., 135:3757; 1991
23. Lashmore, D.S. and M.P. Dariel, J. Electrochem. Soc., 135:1218; 1988
24. Haseeb, A. et al., J. Electrochem. Soc., 141:230; 1994
25. Celis, J-P. et al., Trans. Inst. Met. Fin., 76:163; 1998
26. Baibich, M.N. et al., Phys. Rev. Lett., 61:2472; 1988
27. Wilcox, G.D. and D.R. Gabe, Corrosion Science, 35: 1251; 1993
28. Chawa, G. et al., Trans. Inst. Met. Fin., 76:117; 1998
29. Kalantary, M.R. et al., Electrochim Acta, 40:1609; 1994
30. Kalantary, M.R. et al., Brit. Corr. J., 33:197; 1998
31. Yan, H. et al., Phil. Mag., 70A:373,391; 1994
32. Yan, H. et al., J. Electrochem. Soc., 143:1577; 1996
33. Yongzhong, L. et al., Plating and Surface Finishing, 85(3):60;
34. Yongzhong, L. et al., Plating and Surface Finishing, 85(8):62;
35. Yongzhong, L. et al., Plating and Surface Finishing, 85(9):88; 1998
36. Jensen, J.D. et al., Surface Coating Technology, 105: 240; 1998
37. Jensen, J.D. et al., Trans. IMF, 76:187; 1998
38. Nittipanyawong, C. et al., Proc. SURFIN 2000, 5th Int. Pulse Plating Symp., Chicago; June 2000
39. Wilcox, G.D. et al., J. Appl. Electrochem. (submitted 2002)
40. Chow, K.M. et al., Surface Coating Technology, 99: 161; 1998
41. Czerwinski, F., Plating and Surface Finishing, 87(4): 68; 2000
42. Gabe, D.R. and WA Green, Surface Coating Technology, 105:195; 1998
43. Hoekstra, J. et al., J. Mat. Res., 9:2190; 1994
44. Verbrugge, H.M. and C.W. Tobias, J. Electrochem. Soc., 132:1298; 1985