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Volumn 3825, Issue , 1999, Pages 16-23
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Wafer level inspection for determination of yield of surface-micromachined pressure sensors
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Author keywords
AFM; interference rings; interferometry; pressure sensor; Surface micromachining; wafer level inspection; yield
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
CMOS INTEGRATED CIRCUITS;
COMPOSITE MICROMECHANICS;
FIELD EFFECT TRANSISTORS;
INTERFEROMETRY;
MICROMACHINING;
PRESSURE SENSORS;
SURFACE MICROMACHINING;
AFM;
COMMERCIAL-SCALE PRODUCTION;
ELECTRICAL AND MECHANICAL PROPERTIES;
INTERFERENCE RINGS;
SURFACE MICROMACHINING PROCESS;
WAFER LEVEL;
WHITE-LIGHT INTERFEROMETRY;
YIELD;
INSPECTION;
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EID: 0010435631
PISSN: 0277786X
EISSN: 1996756X
Source Type: Conference Proceeding
DOI: 10.1117/12.364296 Document Type: Conference Paper |
Times cited : (3)
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References (7)
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