Tailoring of isolation structures with top-surface imaging process by silylation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3333, Issue , 1998, Pages 554-561

  Kim, Hyoung Gi ^a   Kim, Myoung Soo ^a   Bok, Cheol Kyu ^a   Park, Byung Jun ^a   Kim, Jin Woong ^a   Baik, Ki Ho ^a   Lee, Dai Hoon ^a  

^a Hynix Semiconductor Inc   (South Korea)

Author keywords

Dry development; DUV lithography; Line Edge Roughness (LER); Rework; Silylation; TIPS

Indexed keywords

CURING; PHOTORESISTS; SILANES;

DRY DEVELOPMENT; DUV LITHOGRAPHY; LINE EDGE ROUGHNESS (LER); REWORK; SILYLATION; TIPS;

ROUGHNESS MEASUREMENT;

EID: 0010278036     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.312458     Document Type: Conference Paper

References (7)

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