Boundary element analysis of delamination in IC packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 153-159

  Tay, A A O ^a   Lee, K H ^a   Lim, K M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; CRACK PROPAGATION; CRYSTAL DEFECTS; DELAMINATION; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); STRESS INTENSITY FACTORS;

INTERFACIAL DELAMINATION; VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT;

ELECTRONICS PACKAGING;

EID: 0032230697     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (26)