Cleaning techniques for low-K dielectric materials for advanced interconnects

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3333, Issue , 1998, Pages 1420-1425

  Louis, Didier ^a   Lajoinie, Emile ^b   Holmes, Douglas ^c   Lee, Shihying ^c   Peyne, Catherine ^c  

^a CEA LETI   (France)

^b CEA GRENOBLE   (France)

^c EKC Technology Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

METAL RECOVERY; PHOTORESISTS; STRIPPING (DYES);

DIELECTRIC CONSTANTS; INTER-METAL DIELECTRICS; LOW-K DIELECTRIC MATERIALS; NEW STRATEGIES; SILSESQUIOXANE;

DIELECTRIC MATERIALS;

EID: 0009337964     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.312372     Document Type: Conference Paper

References (7)

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5. J. Waeterloos, H. Meynen, B. Coengrachts : "Low-k organic spin-on material in a non-etchback interconnect strategy", Proc. Of Dielectric Multilevel Conference, p. 52-59, 1996.
6. N. P. Hacker, "Organic and inorganic spin-on polymers for low-dielectric constant applications", Material Research Society, Vol. 22-10, p. 33-37, 1997.
7. W. M. Lee, "A proven sub-micron photoresist stripper solution for post metal and via hole processes" Symposium on Interconnects, Contact Metallization and Multilevel Metallization, J. of Electrochemical Society, Vol 93-25.