Change in stress, stress sensitivity and activation energy during superplastic deformation of silicon nitride

Materials Science and Engineering: A

Volumn 268, Issue 1-2, 1999, Pages 141-146

  Kondo, N ^a   Suzuki, Y ^a   Ohji, T ^a   Sato, E ^b   Wakai, F ^c  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

^c TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Activation energy; Deformation stress; Silicon nitride; Stress sensitivity; Superplastic deformation; Viscous flow

Indexed keywords

ACTIVATION ENERGY; GRAIN BOUNDARIES; NON NEWTONIAN FLOW; NUCLEATION; PLASTIC DEFORMATION; PRECIPITATION (CHEMICAL); STRESSES; SUPERPLASTICITY; VISCOUS FLOW;

STRESS SENSITIVITY; SUPERPLASTIC DEFORMATION;

SILICON NITRIDE;

EID: 0007604632     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(99)00117-3     Document Type: Article

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