Strength of nanoscale copper under shear

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 4 I, 2000, Pages 1202-1206

  Heino, P ^a   Holloway, P ^b   Ristolainen, E ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b J Crayton Pruitt Family Department of Biomedical Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL ATOMIC STRUCTURE; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; DISLOCATIONS (CRYSTALS); ELECTRONICS PACKAGING; GRAIN SIZE AND SHAPE; MOLECULAR DYNAMICS; POLYCRYSTALLINE MATERIALS; SHEAR STRENGTH; SHEAR STRESS; SINGLE CRYSTALS; STRAIN RATE;

EDGE DISLOCATIONS; SCREW DISLOCATIONS;

COPPER;

EID: 0006933631     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582325     Document Type: Article

References (29)

1. C.-K. Hu, B. Luther, F. B. Kaufman, J. Hummel, C. Uzoh, and D. J. Pearson, Thin Solid Films 262, 84 (1995).
2. Y. K. Huang, A. A. Menovsky, and F. R. de Boer, Nanostruct. Mater. 2, 505 (1993).
3. A. E. Berkowitz, J. R. Mitchell, M. J. Cary, A. P. Young, and S. Zhang, Phys. Rev. Lett. 68, 3745 (1992).
4. J. B. Adams, W. G. Wolfer, and S. M. Foiles, Phys. Rev. B 40, 9479 (1989).
5. D. Wolf and J. F. Lutsko, Phys. Rev. Lett. 60, 1170 (1988).
6. J. A. Eastman, M. R. Fitzsimmons, and L. J. Thompson, Philos. Mag. B 66, 667 (1992).
7. J. Klam, H. Hahn, and H. Gleiter, Acta Metall. 35, 2101 (1987).
8. O. C. Zienkiewicz and R. L. Taylor, The Finite Element Method (McGraw-Hill, New York, 1994).
9. H. J. Herrmann and S. Roux, Statistical Models for the Fracture of Disordered Media (Elsevier Science, Amsterdam, 1990).
10. M. P. Allen and D. J. Tildesley, Computer Simulation of Liquids (Oxford University Press, London, 1987).
11. M. S. Daw and M. I. Baskes, Phys. Rev. B 29, 6443 (1984).
12. K. W. Jacobsen, J. K. Nørskov, and M. J. Puska, Phys. Rev. B 35, 7423 (1987).
13. P. Heino, L. Perondi, K. Kaski, and E. Ristolainen, Phys. Rev. B 60, 14625 (1999).
14. S. J. Zhou, D. M. Beazley, P. S. Lomdahl, and B. L. Holian, Phys. Rev. Lett. 78, 479 (1997).
15. H. Häkkinen and M. Manninen, J. Phys.: Condens. Matter 1, 9765 (1989).
16. J. Schiøtz and K. W. Jacobsen, Philos. Mag. Lett. 72, 245 (1995).
17. P. Heino, H. Häkkinen, and K. Kaski, Europhys. Lett. 41, 273 (1998).
18. J. Schiøtz, F. D. D. Tolla, and K. W. Jacobsen, Nature (London) 391, 561 (1998).
19. P. Heino, H. Häkkinen, and K. Kaski, Phys. Rev B 58, 641 (1998).
20. S. Nosé, Progr. Theor. Phys. Suppl.103, 1 (1991).
21. G. W. Nieman, J. R. Weertman, and R. W. Siegel, J. Mater. Res. 6, 1012 (1991).
22. R. G. Budynas, Advanced Strength and Applied Stress Analysis, 2nd ed. (McGraw-Hill, New York, 1999).
23. J. Schiøtz, T. Vegge, F. D. D. Tolla, and K. W. Jacobsen, in Proceedings of the 19th Risø International Symposium on Materials Science (Risø National Laboratory, Roskilde, Denmark, 1998).
24. L. D. Landau and E. M. Lifshitz, Theory of Elasticity, 3rd rev. English ed. (Pergamon, New York, 1986).
25. J. P. Hirth and J. Lothe, Theory of Dislocations (McGraw-Hill, New York, 1968).
26. P. Heino and E. Ristolainen, Nanostruct. Mater. 11, 587 (1999).
27. P. Heino and E. Ristolainen, IEEE Trans. Adv. Packaging 22, 510 (1999).
28. J. H. Lau and Y.-H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip and Finit Pitch SMT Assemblies (McGraw-Hill, New York, 1997).
29. B. Vandevelve, F. Christiaens, E. Beyne, J. Roggen, J. Peeters, K. Allaert, D. Vandepitte, and J. Bergmans, IEEE Trans. Compon., Packag. Manuf. Technol., Part A 21, 177 (1998).