Material and process studies in the integration of plasma-promoted chemical-vapor deposition of aluminum with benzocyclobutene low-dielectric constant polymer

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 1, 2000, Pages 252-261

  Talevi, Robert ^a   Gundlach, Heidi ^a   Bian, Zailong ^a   Knorr, Andreas ^a   Van Gestel, Maarten ^a   Padiyar, Sumant ^a   Kaloyeros, Alain E ^a   Geer, Robert E ^a   Shaffer, Edward O ^b   Martin, Steve ^b  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; DIELECTRIC PROPERTIES; METALLIZING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SURFACE STRUCTURE;

BENZOCYCLOBUTENES; METAL/DIELECTRIC STACKS; MULTI-LEVEL METALLIZATION METHOD;

THERMOSETS;

EID: 0006661268     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.591180     Document Type: Article

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