Advances in stress test chips

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 226, Issue , 1997, Pages 1-5

  Jaeger, Richard C ^a   Suhling, Jeffrey C ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005399760     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (31)

1. Beaty, R. E., Suhling, J. C., Moody, C. A., Bittle, D. A., Johnson, R. W., Butler, R. D. and Jaeger, R. C., 1990, "Calibration Considerations for Piezoresistive-Based Stress Sensors," in the Proceedings of the 40th Electronic Components and Technology Conference, IEEE, May 20-23, 1990, Las Vegas, NV, pp. 797-806.
2. Bittle, D. A., Suhling, J. C., Beaty, R. E., Jaeger , R. C. and Johnson, R. W., 1991, "Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages," Journal of Electronic Packaging, Vol. 113(3), pp. 203-215.
3. Cordes, R. A., Suhling, J. C., Kang, Y. and Jaeger, R. C. , 1995, "Optimal Temperature Compensated Piezoresistive Stress Sensor Rosettes," Proceedings of the Symposium on Applications of Experimental Mechanics to Electronic Packaging, ASME EEP-Vol. 12, pp. 109-116.
4. Dorey, A. P. and Maddern, T. S., 1969, "The Effect of Strain on MOS Transistors," Solid-State Electronics, Vol. 12, pp. 185-189.
5. Dorey, A. P., 1975, "A High Sensitivity Semiconductor Strain Sensitive Circuit," Solid-State Electronics, Vol. 18(4), pp. 295-299.
6. Edwards, D. R., Heinen, G., Bednarz, G. A. and Schroen, W. H., 1983, "Test Structure Methodology of IC Package Material Characterization," in the Proceedings of the 33rd Electronic Components Conference, IEEE, pp. 386-393.
7. Edwards, D. R., Heinen, K. G., Martinez, J. E. and Groothuis, S., 1987, "Shear Stress Evaluation of Plastic Packages," in the Proceedings of the 37th Electronic Components Conference, IEEE, pp. 84-95.
8. Gee, S. A., Akylas, V. R. and Van Den Bogert, W. F., 1988, "The Design and Calibration of a Semiconductor Strain Gauge Array," in the Proceedings of the 1988 IEEE International Conference on Microelectronic Test Structures.
9. Gee, S. A., Van Den Bogert, W. F. and Akylas, V. R., 1989, "Strain-Gauge Mapping of Die Surface Stresses," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12(4), pp. 587-593.
10. Jaeger, R. C., Suhling, J. C., Carey, M. T. and Johnson, R. W., 1993a,"A Piezoresistive Sensor Chip for Measurement of Stress in Electronic Packaging," Proceedings of the 1993 Electronic Components and Technology Conference, pp. 686-692.
11. Jaeger, R. C., Suhling, J. C., Carey, M. T. and Johnson, R. W., 1993b, "Off-Axis Sensor Rosettes for Measurement of the Piezoresistive Coefficients in Silicon," IEEE Transactions on. Components, Packaging, and Manufacturing Technology, Vol. 16(8), pp. 925-931.
12. Jaeger, R. C., Suhling, J. C., Ramani, R. and Anderson, A. A., 1994a, "A (100) Silicon Stress Test Chip with Optimized Piezoresistive Sensor Rosettes," Proceedings of the 1994 Electronic Components and Technology Conference (ECTC). pp. 741-749.
13. Jaeger, R. C., Suhling, J. C., Ramani, R., 1994b, "Errors Associated with the Design, Calibration and Application of Piezoresistive Stress Sensors in (100) silicon," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 17(1), pp. 97-107.
14. Jaeger, R. C., Ramanathan, R. and J. C. Suhling, J. C., 1995a, "Effects of Stress-Induced Mismatches on CMOS Analog Circuits," Proceedings of the 1995 International VLSI TSA Symposium, Taipei, Taiwan, pp. 354-360.
15. Jaeger, R. C., Ramanathan, R., Suhling, J. C. and Kang, Y., 1995b, "CMOS Stress Sensor Circuits Using Piezoresistive Field-Effect Transistors (PIFETS)," Digest of Technical Papers of the 1995 International Symposium on VLSI Circuits, pp. 43-44.
16. Jaeger, R. C., Bradley, A. T., Suhling, J. C. and Zou, Y., 1997, "FET Mobility Degradation and Device Mismatch Due to Packaging Induced Die Stress," 1997 ESSCIRC Proceedings.
17. Mian, A., Suhling, J. C., Jaeger, R. C., "Evaluation of Die Stress Using van der Pauw Sensors," This Volume.
18. Mikoshiba, H., 1981, "Stress-Sensitive Properties of Silicon-Gate MOS devices," Solid-State Electronics, Vol. 24, pp. 185-189.
19. Miura, H., Nishimura, A., Kawai, S. and Nishi, K., 1987, "Development and Application of the Stress Sensing Test Chip for IC Plastic Packages," in the Proceedings of the 64th Annual Meeting of the Japanese Society of Mechanical Engineers, pp. 1826-1832.
20. Miura, H., Nishimura, A., Kawai, S. and Murakami, G., 1990, "Structural Effect of IC Plastic Package on Residual Stress in Silicon Chips," in the Proceedings of the 40th Electronic Components and Technology Conference, IEEE, May 20-23, 1990, Las Vegas, NV, pp. 316-321.
21. Natarajan, B. and Bhattacharyya, B., 1986, "Die Surface Stresses in a Molded Plastic Package," in the Proceedings of the 36th Electronic Components Conference, IEEE, pp. 544-551.
22. Spencer, J. L., Schroen, W. H., Bednarz, G. A., Bryan, J. A., Metzgar, T. D., Cleveland, R. D. and Edwards, D. R., 1981, "New Quantitative Measurements of IC Stress Introduced by Plastic Packages," in the Proceedings of the 19th Annual Reliability Physics Symposium, IEEE, pp. 74-80.
23. Suhling, J. C. , Jaeger, R. C., Lin, S. T., Moral, R. J. and Zou, Y., 1997a, "Measurement of the Complete Stress State in Plastic Encapsulated Packages," Advances in Electronic Packaging 1997, ASME EEP-Vol. 19-2, pp. 1741-1750.
24. Suhling, J. C. , Jaeger, R. C., Lin, S. T., Mian, A. K. M. and Cordes, R. A., 1997b, "Design and Calibration of Optimized (111) Silicon Stress Sensing Test Chips," Advances in Electronic Packaging 1997, ASME EEP-Vol. 19-2, pp. 1723-1730.
25. Sweet, J. N. and Peterson, D. W., 1993, "High Accuracy Die Mechanical Stress Measurement with the ATC04 Assembly Test Chip," Proceedings of the 1993 IEEE Reliability Workshop, pp. 1-8.
26. th Electronic Components and Technology Conference (ECTC), IEEE, pp. 300-307.
27. Sweet, J. N., Burchett, S. N. , Peterson, D. W., Hsia, A. H. and Chen, A., 1997, Piezoresistive Measurement and FEM Analysis of Mechanical Stresses in 160L Plastic Quad Flat Packs," Advances in Electronic Packaging 1997, ASME EEP-Vol. 19-2, pp. 1731-1740.
28. van Gestel, R., 1994, Reliability Related Research on Plastic IC-Packages: A Test Chip Approach, Delft University Press, The Netherlands.
29. van Gestel, R., Bossche, A. and Mollinger, J. R., 1991, "On-chip Piezoresistive Stress Measurements in Three Directions," Sensors and Actuators A, Vol. 25, pp. 801-807.
30. Zou, Y., Lin, S. T., Suhling, J. C., Jaeger, R. C., Nguyen, L. and Gee, S. A., 1997a, "Characterization of Plastic Packages Using (100) Silicon Stress Test Chips," This Volume.
31. Zou, Y., Suhling, J. C., Jaeger, R. C. and Ali, H., 1997b, "Comparison of Stresses within Delaminated and Non-Delaminated Plastic Packages," This Volume.