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Volumn 70, Issue 6, 2000, Pages 377-386

Crack propagation in a functionally graded plate under thermal shock

Author keywords

Compositional profile; Curved crack; Finite element method; Functionally graded material; Thermal shock

Indexed keywords


EID: 0005316908     PISSN: 09391533     EISSN: None     Source Type: Journal    
DOI: 10.1007/s004199900069     Document Type: Article
Times cited : (31)

References (19)
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  • 3
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  • 4
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    • Noda, N.1
  • 7
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  • 8
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    • Herrmann, K. P.; Dong, M.: Thermal crack growth in self-stressed two- and three-dimensional bimaterials. Proc. 1st Int. Symp. (Hamamatsu, Japan, June, 1995). Thermal Stresses '95 (1995) 131-134
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  • 9
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    • Ferber, F.; Hermann, K. P.: Modeling of elementary failure mechanisms arising in thermo-mechanically loaded material models. Proc. 1st Int. Symp. (Hamamatsu, Japan, June, 1995). Thermal Stresses '95 (1995) 135-138
    • (1995) Thermal Stresses '95 , pp. 135-138
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  • 10
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    • Thermal shock fracture mechanism of metal/ceramic functionally gradient materials
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  • 11
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  • 12
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.