Analysis of design efficiency for the disassembly of modular electronic products

Journal of Electronics Manufacturing

Volumn 9, Issue 1, 1999, Pages 79-95

  Veerakamolmal, Pitipong ^a   Gupta, Surendra M ^a  

^a NORTHEASTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; ENVIRONMENTAL IMPACT; ENVIRONMENTAL PROTECTION; LIFE CYCLE; PRODUCT DESIGN; PRODUCT DEVELOPMENT; RECYCLING; SERVICE LIFE;

DESIGN FOR DISASSEMBLY; END-OF-LIFE DISASSEMBLY;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 0004944786     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313199000301     Document Type: Article

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