Al-based sputter-deposited films for large liquid-crystal-display

Thin Solid Films

Volumn 337, Issue 1-2, 1999, Pages 235-239

  Takatsuji, Hiroshi ^a   Arai, Toshiaki ^a   Tsuji, Satoshi ^a   Kuroda, K ^b   Saka, H ^b  

^a IBM JAPAN LTD   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

Author keywords

Aluminum thin film; Large glass substrate; Sputtering; Taguchi methods; Thin film transistor liquid crystal displays

Indexed keywords

EID: 0003461881     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01384-4     Document Type: Article

References (16)

1. W.E. Howard, J. SID 3 (3) (1995) 127.
2. W.C. O'Mara, Solid State Technol., (1996) 76.
3. P. Chaudhari, J. Appl. Phys. 45 (10) (1974) 4339.
4. F. Ericson, N. Kristensen, J-A. Schweitz, U. Smith, J. Vac. Sci. Technol. B 9 (1) (1991) 58.
5. K. Hideo, Y. Homma, Y. Sasaki, J. Vac. Sci. Technol. A 14 (4) (1996) 2579.
6. K.P. Rodbell, D.B. Knorr, J.D. Mis, J. Electr. Mater. 22 (6) (1993) 597.
7. A.N. Campbell, R.E. Mikawa, D.B. Knorr, J. Electr. Mater. 22 (6) (1993) 589.
8. D.P. Field, D.J. Dingley, Solid State Technol., (1995) 91.
9. T. Onishi, E. Iwamura, K. Takagi, K. Yoshikawa, J. Vac. Sci. Technol. A 14 (5) (1996) 2728.
10. S. Takayama, N. Tsutsui, J. Vac. Sci. Technol. A 14 (4) (1996) 2499.
11. C.W. Kim, C.O. Jeong, H.S. Song, et al., SID 96 Digest, 1996, p. 337.
12. K, Dehnad, Quality Control, Robust Design and the Taguchi Method, Brooks/Cole, Pacific Grove, CA, 1989.
13. H. Takatsuji, S. Tsuji, H, Kitahara, K. Tsujimoto, K. Kuroda, H. Saka, Mater. Res. Soc. Symp. Proc., 441 p. 416.
14. Thomas G. Gunn, 21st Century Manufacturing, Harper-Collins, NY, pp. 83-86.
15. R.B. Dingwall, M.J. Duell, Taguchi Method Optimization of a Sensor System, ASQC Quality Congress Transactions, 1989, pp. 710-718.
16. M.S. Phadke, Quality Engineering Using Robust Design, Prentice-Hall, Englewood Cliffs, NJ, 1989, p. 291.