Effect of entrapped carbon on the microwave dielectric loss of silica-based ceramic packaging material

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 2, 1996, Pages 155-161

  Partlow, Deborah P ^a   Gipprich, John W ^a   Zaki, Kawthar A ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; CERAMIC MATERIALS; ELECTRIC LOSSES; ELECTRIC PROPERTIES; MATERIALS TESTING; MULTILAYERS; PERFORMANCE;

DIELECTRIC TESTING; ENTRAPPED CARBON; MICROWAVE DIELECTRIC LOSS; MULTILAYER PACKAGES; SILICA BASED CERAMIC PACKAGING MATERIALS;

ELECTRONICS PACKAGING;

EID: 0030170110     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)