Thermal management strategies for embedded electronic components of wearable computers

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 2, 2000, Pages 98-106

  Egan, Eric ^a   Amon, Cristina H ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002671165     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483140     Document Type: Article

References (14)

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3. Siewiorek, D. P., Smailagic, A., Lee, J., and Tabatabai, A. R. A., 1994, “An Interdisciplinary Concurrent Design Methodology as Applied to the Navigator Wearable Computer System,” J. Comput. Software Eng., 2, No. 3, pp. 259-292.
4. Amon, C. H., Nigen, J. S., Siewiorek, D. P., Smailagic, A., and Stivoric, J. M., 1995, “Concurrent Design and Analysis of the Navigator Wearable Computer System: The Thermal Perspective,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 18, No. 3, pp. 567-577.
5. Amon, C. H., Egan, E., Siewiorek, D., and Smailagic, A., 1997, “Thermal Management and Concurrent System Design of a Wearable Multicomputer,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, No. 2, pp. 128-137.
6. Amon, C., Beuth, J., Kirchner, H., Merz, R., Prinz, F., Schmaltz, K., and Weiss, L., 1993, “Material Issues in Layered Forming,” Proc. Solid Freeform Fabrication Symp., H. L. Marcus et al., eds., Austin, TX, pp. 1-10.
7. Amon, C. H., Beuth, J. L., Weiss, L. E., Merz, R., and Prinz, F. B., 1998, “Shape Deposition Manufacturing With Microcasting: Processing, Thermal, and Mechanical Issues,” ASME J. Manuf. Sci. Eng., 120, pp. 656-668.
8. Bigg, D. M., 1986, “Thermally Conductive Polymer Compositions,” Polym. Compos., 7, pp. 125-126.
9. Egan, E., and Amon, C. H., 1996, “Cooling Strategies for Embedded Electronic Components of Wearable Computers Fabricated by Shape Deposition Manufacturing,” I-Therm '96, IEEE InterSociety Conference on Thermal Phenomena, Orlando, FL, pp. 13-20.
10. Egan, E. R., and Amon, C. H., 1997, “A Study on the Thermal Conductivity Enhancement of Several Polymer Composites for Embedded Electronics Applications,” ASME-HTD Proc. of the 32nd National Heat Transfer Conference, 6, pp. 103-109.
11. Ahmed, I., Krane, R. J., and Parsons, J. R., 1994, “A Preliminary Investigation of the Cooling of Electronic Components with Flat Plate Heat Sinks,” ASME J. Electron. Packag., 116, No. 1, pp. 60-67.
12. Ellison, G. N., 1984, Thermal Computations for Electronic Equipment, Van Nostrand Reinhold Company Inc., New York, pp. 75-93.
13. Incropera, F. P., and De Witt, D. P., 1990, Fundamentals of Heat and Mass Transfer, 3rd ed., John Wiley & Sons, Inc., New York, pp. 533-559 and pp. 794-806.
14. Egan, E., and Amon, C. H., 1995, “Thermal Design of Wearable Computers: Application to the Navigator2, Thermal Management Devices, and Embedded Electronics,” EDRC Report No. 24-123-95, Carnegie Mellon University, Pittsburgh, PA.