Underhood reliability of PBGAs

Surface mount technology

Volumn 12, Issue 8, 1998, Pages

  Adams, Rick ^a   Glovatsky, Andrew ^a   Lindley, Theresa ^a   Evans, John ^a   Mawer, Andrew ^a  

^a VISTEON CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FRACTURE; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; PLASTIC PRODUCTS; POLYURETHANES; RELIABILITY; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING;

PLASTIC BALL GRID ARRAYS (PBGA);

SURFACE MOUNT TECHNOLOGY;

EID: 0032138417     PISSN: 08933588     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)