"MEMS challenge: Can this technology catch the internet lightwave?"

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AB, Issue , 2000, Pages 615-622

  Gilleo, Ken ^a  

^a Assembly Materials Group

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; LIGHT; MOEMS; OPTICAL FIBERS; OPTICAL SWITCHES; PHOTONS;

LIGHT WAVE; LONG HAUL; MICRO MIRROR; MICRO OPTO ELECTRO MECHANICAL SYSTEMS; PHONE CALLS; SLOW ELECTRONS; TERRESTRIAL COMMUNICATION; UNDERWATER COMMUNICATION; WAVE DIVISIONS; WIDE BANDWIDTH;

MIRRORS;

EID: 0002060413     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-1154     Document Type: Conference Paper

References (8)

1. Gilleo, K., "MEMS PCB Assembly Challenge", pp. 62, 64 66,68,70, Circuits Assembly, March 2000.
2. Mignardi, M., "From ICs to DMDs", TI Technical Journal, pp. 56 - 63, July - Sept. 1998 (http://www.TI.com).
3. Gilleo, K., "MEMS Packaging Solutions", pp. 49, 50, 52, 53, 55, 56, EP & P, June 2000.
4. Miller, W. M., "MEMS Reliability and Testing", IMAPS Packaging of MEMS Microsystems Workshop, Chicago, Oct. 23 - 24, 1999.
5. Martin, J. and Zhao, Y., "Micromachined Devices Packaged to Reduce Suction", US Patent 5,694,740, Dec. 9, 1997.
6. Gilleo, K. & Bacon, G, "Parylene Coatings for MEMS", to be published, Vacuum Technology & Coating, July 2000.
7. Gilleo, K., Blumel, D., "The 4-Way Underfill Race", pp. 701 - 706, Proc. International Symposium on Microelectronics, IMAPS, San Diego, CA, Nov. 4, 1998.
8. Previti, M., "No Flow Underfill Reliability is Here - Finally", pp. P-MT1/1-1 - 1-4, APEX Technical Proc, Long Beach, CA, March 12 - 16, 2000.