Computer modeling as a tool to predict deposition rate and film composition in the reactive sputtering process

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 16, Issue 3, 1998, Pages 1277-1285

  Berg, S ^a   Nyberg, T ^a   Blom, H O ^a   Nender, C ^a  

^a UPPSALA UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001626190     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581274     Document Type: Article

References (12)

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5. M. Moradi, C. Nender, H.-O. Blom, and S. Berg. Vacuum 41, 1974 (1990).
6. W. D. Sproul, M. E. Graham, M.-S. Wong, P. J. Rudnik, and K. O. Legg, in Handbook of Thin Film Process Technology, edited by S. I. Shah and D. Glocker (Institute of Physics Publishing, Bristol, UK, 1995), pp. X1.4:1-X1.4:5.
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10. Alberta Microelectronic Center, No. 318, 11315-87 Avenue, Edmonton, Alberta, Canada T6G 2T9, 1997.
11. C. Nender, I. V. Katardjiev, J. P. Biersack, S. Berg, and A. M. Barklund, Radiat. Eff. Defects Solids 130-131, 281 (1994).
12. J. P. Biersack, S. Berg, and C. Nender, Nucl. Instrum. Methods Phys. Res. B 59-60, 21 (1993).