Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1: Substrate influence on TTT and CHT curing diagrams of wood adhesives;Einfluß der Aushärtebedingungen auf das Verhalten von Holzverbindungen mit hitzehärtenden Klebern. Teil 1: Einfluß des Substrates auf TTT- Und CHT-Diagramme von Holzklebern

Holz als Roh - und Werkstoff

Volumn 56, Issue 5, 1998, Pages 339-346

  Lu, X ^a   Pizzi, A ^b  

^a NANJING FORESTRY UNIVERSITY   (China)

^b UNIVERSITÉ DE LORRAINE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001602646     PISSN: 00183768     EISSN: None     Source Type: Trade Journal    
DOI: 10.1007/s001070050330     Document Type: Article

References (23)

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