Techniques and applications of secondary ion mass spectrometry and spreading resistance profiling to measure ultrashallow junction implants down to 0.5 keV B and BF2

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 16, Issue 1, 1998, Pages 286-291

  Harrington, William L ^a   Magee, Charles W ^a   Pawlik, Marek ^b   Downey, Daniel F ^c   Osburn, Carlton M ^d   Felch, Susan B ^e  

^a Semiconduct Assess Services Ltd ^*  (United States)

^b Semiconduct Assess Services Ltd   (United Kingdom)

^c VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES   (United States)

^d NORTH CAROLINA STATE UNIVERSITY   (United States)

^e Varian Ginzton Research Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001543994     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. National Technology Roadmap for Semiconductors, Semiconductor Industries Association 1994.
2. P. Lundquist, B. Pederson, D. Ackerman, and D. Brown, Proceedings of the 11th International Conference on Ion Implant Technology Austin, TX, 1996, p. 466.
3. J. England, L. Joyce, C. Burgess, S. Moffatt, M. Foad, D. Armour, and M. Current, Ref. 2, p. 470.
4. J. R. Conrad, J. L. Radtke, R. A. Dodd, F. J. Worzala, and N. C. Tran, J. Appl. Phys. 62, 4591 (1987).
5. C. W. Magee, J. R. Shallenberger, M. S. Denker, D. F. Downey, and L. Meloni, J. Vac. Sci. Technol. B, these proceedings.
6. M. Pawlik, J. Vac. Sci. Technol. B, these proceedings.
7. D. F. Downey, C. M. Osburn, J. J. Cummings, S. L. Daryanani, and S. W. Falk, Thin Solid Films (to be published).
8. R. B. Fair, PREDICT: Process Estimator for the Design of Integrated Circuit Technologies (Microelectronics Center of North Carolina, Research Triangle Park, NC, 1986).
9. ASTM Standard No. F723-82, 1987.