Cleaning force in laser cleaning of silicon substrates

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3184, Issue , 1997, Pages 158-165

  Song, W D ^a   Lu, Y F ^b   Ye, K D ^a   Tee, C K ^b   Hong, M H ^a   Liu, D M ^a   Low, T S ^a  

^a DATA STORAGE INSTITUTE   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Cleaning force; Laser cleaning; Silicon substrate; Thermal stress

Indexed keywords

ADHESION; CHIP SCALE PACKAGES; CLEANING; ELECTRIC NETWORK ANALYSIS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; LASER PULSES; LASERS; MICROELECTRONIC PROCESSING; MICROELECTRONICS; OXIDE MINERALS; PULSE GENERATORS; PULSED LASER APPLICATIONS; QUARTZ; STRENGTH OF MATERIALS; SUBSTRATES; THERMAL EXPANSION; THERMAL SPRAYING; THERMAL STRESS; THERMOELASTICITY;

ABSORBING PARTICLES; ADHESION FORCES; CLEANING EFFICIENCIES; LASER CLEANING; LASER FLUENCE; LASER REMOVALS; LASER WAVELENGTHS; LINEAR THERMAL EXPANSION COEFFICIENTS; PULSE DURATIONS; QUARTZ PARTICLES; SILICON SUBSTRATE; SILICON SURFACES; SOLID SURFACES; SUBSTRATE SURFACES; TEMPERATURE RISES; THEORETICAL ANALYSES; THRESHOLD FLUENCE;

SURFACE CLEANING;

EID: 0001501812     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.280569     Document Type: Conference Paper

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