On the effect of grain boundary segregation on electromigration driving force in thin metal films

Materials Letters

Volumn 26, Issue 1-2, 1996, Pages 65-68

  Glickman, Evgeny ^a   Molotskii, Michele ^b  

^a HEBREW UNIVERSITY OF JERUSALEM   (Israel)

^b TEL AVIV UNIVERSITY   (Israel)

Author keywords

Electromigration; Electron and hole wind compensation; Electronegative impurities; Grain boundary; Segregation

Indexed keywords

CHARGE CARRIERS; COPPER; DIFFUSION; GRAIN BOUNDARIES; IMPURITIES; MATHEMATICAL MODELS; METALLIC FILMS; MONOLAYERS; SEGREGATION (METALLOGRAPHY);

ELECTROMIGRATION DRIVING FORCE; ELECTRON WIND COMPENSATION; HOLE WIND COMPENSATION;

ELECTROMIGRATION;

EID: 0029755118     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/0167-577X(95)00209-X     Document Type: Article

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