Metrology study of structural transfer accuracy in fabrication of high-aspect-ratio microelectromechanical systems: From optical mask to polished electroplated parts

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 16, Issue 6, 1998, Pages 3552-3557

  Khan Malek, C ^a   Wood, R ^b   Dudley, B ^b   Geneva, P ^c  

^a LOUISIANA STATE UNIVERSITY   (United States)

^b MCNC   (United States)

^c IEP Group Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000805195     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (19)

1. E. W. Becker, W. Ehrfeld, P. Hagmann, A. Maner, and D. Munchmeyer, Microelectron. Eng. 4, 35 (1986).
2. The HI-MEMS Alliance is an integrated collaborative US effort initially funded by (D)ARPA for 2 years (1994-1996) to establish a base and methods for cost-effective, low-to-mid volume batch fabrication of primary parts with LIGA. Members included MCNC (North Carolina), CAMD (Louisiana State University), University of Wisconsin, ORNL (Tennessee), IBM Yorktown Heights, ARDEC (U.S. Army), NSWC (U.S. Navy), North Carolina State University, IEP (North Carolina), and TVJ-Dover (Chicago). See http://mems.mcnc.org/Hlclick.html.
3. H. Guckel, Rev. Sci. Instrum. 67. 1 (1996)
4. http://mems.mcnc.org, http://www.camd.lsu.edu, http://www.iepgroup.com.
5. D. Munchmeyer and W. Ehrfeld, Proc. SPIE 803, 72 (1987).
6. C. M. Egert, R. Wood, and C. Khan Malek, Proc. SPIE 2880, 200 (1996).
7. W. Glashauser and G. V. Ghica, U.S. Patent 4,393,129 (Jul. 12, 1983).
8. F. J. Pantenburg and J. Mohr, Nucl. Instrum. Methods Phys. Res. B 97, 551 (1995).
9. H. Zumaque, G. A. Kohring, and J. Hormes, J. Micromech. Microeng. 7, 79 (1997).
10. G. Feiertag, W. Ehrfeld, H. Lehr, A. Schmidt, and M. Schmidt, J. Micromech. Microeng. 7, 323 (1997).
11. G. Feiertag, M. Schmidt, and A. Schmidt, Microelectron. Eng. 27, 513 (1995).
12. O. Schmalz, M. Hess, and R. Kosfeld, Angew. Makromol. Chem. 239, 93 (1996).
13. Y. Vladimirksy, O. Vladimirsky, G. M. Calderon, H. M. Manohara, K. J. Morris, and M. Klopf, Proc. SPIE 2880, 183 (1996).
14. A. C. Henry, R. L. McCarley, S. Das, C. Khan, and D. S. Poche, J. Microsystem Technol. 4, 104 (1998).
15. J. A. Moore and J. O. Choi, ACS Symp. Ser. (1991).
16. J. Mohr, W. Ehrfeld, and D. Munchmeyer, J. Vac. Sci. Technol. B 6, 2264 (1989).
17. A. EI-Kholi, P. Bley, J. Götten, and J. Mohr, Microelectron. Eng. 21, 271 (1993).
18. A. L. Bogdanov, K. A. Valiev, L. V. Velokov, and S. D. Dushenkov, Mikroelektronika 17, 261 (1988).
19. C. Khan Malek, R. Wood, and P. Geneva, Proc. SPIE 3328, 86 (1998).