A new broadband transmission line model for accurate simulation of dispersive interconnects

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 345-351

  Morsey, J ^a   Coperich, K ^a   Okhmatovski, V ^a   Cangellaris, A C ^a   Ruehli, A ^b  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Bandwidth; Curve fitting; Frequency; Impedance; Inductance; Integrated circuit interconnections; Multiconductor transmission lines; Robustness; Transmission line matrix methods; Transmission lines

Indexed keywords

BANDWIDTH; CIRCUIT SIMULATION; CURVE FITTING; ELECTRIC IMPEDANCE; ELECTRIC LINES; ELECTRONICS PACKAGING; EXTRACTION; INDUCTANCE; MATRIX ALGEBRA; RATIONAL FUNCTIONS; ROBUSTNESS (CONTROL SYSTEMS); TRANSIENT ANALYSIS; TRANSMISSION LINE THEORY; WAVE TRANSMISSION;

BROADBAND TRANSMISSION; FREQUENCY; FUNCTION REPRESENTATIONS; INTEGRATED CIRCUIT INTERCONNECTIONS; MAGNETO QUASI STATICS; MULTI-CONDUCTOR TRANSMISSION LINES; RESISTANCE AND INDUCTANCE; TRANSMISSION LINE MATRIX METHODS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 0000615930     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906398     Document Type: Conference Paper

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