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Volumn 15, Issue 3, 1997, Pages 573-578
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Study of shallow silicon trench etch process using planar inductively coupled plasmas
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0000333071
PISSN: 07342101
EISSN: None
Source Type: Journal
DOI: 10.1116/1.580686 Document Type: Article |
Times cited : (22)
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References (17)
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