Thermal derating - A factor of safety or ignorance

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 1, 1997, Pages 83-85

  Jackson, Margaret A ^a   Lall, Pradeep ^b   Das, Diganta ^c  

^a NORTHROP GRUMMAN CORPORATION   (United States)

^b MOTOROLA INC   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0013448809     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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2. E. B. Hakim, "Reliability prediction: Is Arrhenius erroneous?," Solid State Technol., vol. 57, Aug. 1990.
3. C. J. M. Lasance, "Accurate temperature prediction in consumer electronics: A must but still a myth," in Cooling of Electronics Systems, S. Kakac, H. Yüncü, and K. Hijikata, Eds. Norwell, MA: Kluwer, 1993, pp. 825-858.
4. P. Lall et al., "Characterization of functional relationship between temperature and microelectronic reliability," Microelectron. Reliab., vol. 35, no. 3, pp. 377-402, Mar. 1995.
5. P. Lall, et al., Influence of Temperature on Microelectronics and System Reliability - A Physics of Failure Approach. Boca Raton, FL: CRC, 1997.
6. M. Pecht, and V. Ramappan, "Are components still a major problem? A review of electronic systems and device field failure returns," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 15, pp. 1060-1064, Dec, 1992.
7. K. K. Ng, "A survey of semiconductor devices," IEEE Trans. Electron Devices, vol. 43, pp. 1760-1766, Oct. 1996.
8. Jet Propulsion Laboratory, JPL Derating Guidelines, Electronic Parts Reliability, Section 507, JPL-D-8545, 1994.
9. Naval Air Systems Command, Department of the Navy, Application and Derating Requirements for Electronic Components, AS-4613, 1976.
10. C. Leonard, "Mechanical engineering issues and electronic equipment reliability: Incurred costs without compensating benefits," Trans. ASME: J. Electron. Packag., vol. 113, no. 1, pp. 1-7, Mar. 1991.
11. M. Pecht, "Issues affecting early affordable access to leading electronics technologies by the US military and government," Circuit World, vol. 22, no. 2, pp. 7-15, 1996.
12. P. McCluskey et al. "Uprating of commercial parts for use in harsh environments," CALCE EPRC Rep., Nov. 1996.