Technology Trend of Build-up Printed Wiring Board

Journal of Japan Institute of Electronics Packaging

Volumn 2, Issue 6, 1999, Pages 450-453

  Takazaki, Yoshinori ^a  

^a IBIDEN CO LTD   (Japan)

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Indexed keywords

EID: 33750062727     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.2.450     Document Type: Article

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