Effect of copper and solidification conditions on the microstructure and mechanical properties of Al-Si-Mg alloys

Journal of Materials Processing Technology

Volumn 153-154, Issue 1-3, 2004, Pages 193-198

  Shabestari, S G ^a   Moemeni, H ^a  

^a IRAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Iran)

Author keywords

Aluminum alloys; Cooling rate; Mechanical properties; Microstructure

Indexed keywords

COOLING; COPPER; FRACTURE; HEAT TREATMENT; INTERMETALLICS; MAGNESIUM PRINTING PLATES; MECHANICAL PROPERTIES; MELTING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILICON; SOLIDIFICATION; TENSILE TESTING;

COOLING RATE; DENDRITE NETWORKS; INTERMETALLIC PARTICLES; MELTING POINT;

ALUMINUM ALLOYS;

EID: 9444272821     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2004.04.302     Document Type: Article

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