Optimizing warpage analysis for an optical housing

Mechatronics

Volumn 15, Issue 1, 2005, Pages 111-127

  Subramanian, N R ^a   Tingyu, Lin ^b   Seng, Yak Aik ^c  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

^b Motorola Innovation Centre   (Singapore)

^c JWS Resources Pte Ltd   (Singapore)

Author keywords

CD optical pickup; Complex method; Injection molding; Molding process simulation; Optical housing; Warpage

Indexed keywords

COMPUTER SIMULATION; INJECTION MOLDING; MELTING; OPTIMIZATION; PARAMETER ESTIMATION; PLASTIC PRODUCTS; SENSITIVITY ANALYSIS; SHRINKAGE;

CD OPTICAL PICKUP; COMPLEX METHOD; MOLDING PROCESS SIMULATION; OPTICAL HOUSING; WARPAGE;

OPTICAL SYSTEMS;

EID: 9244249173     PISSN: 09574158     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechatronics.2004.05.004     Document Type: Article

References (5)

1. Box MJ. Comput J 1965;8:43-52.
2. Lee BH et al. Optimization of part wall thickness to reduce warpage in injection moulded part based on the modified complex method, 692/ANTEC96.
3. Lin TY, Yak AS. Reliability by robust design for optical alignment in a CD pickup. ASME/IEEE Mechatronics 2000;5(4):386-93.
4. de Vries J. Deviation optical model CDM12 and VAM2201 lightpen housing. POS Singapore, VUR-22JV-7002, 1997.
5. Yak AS. RLH Housing measurement referencing. POS Singapore, VUB-37-YAS-80205, 1998.