Tensile and bending fracture behaviors and their influence on critical current of multifilamentary Bi2223/Ag/Ag-Mg composite tape

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 68, Issue 9, 2004, Pages 681-687

  Ochiai, Shojiro ^a   Miyazaki, Noboru ^a,c   Nagai, Takashi ^a,c   Doko, Dan ^a   Okuda, Hiroshi ^a   Oh, Sang Soo ^b   Hojo, Masaki ^a   Tanaka, Mototsugu ^a   Osamura, Kozo ^a  

^a KYOTO UNIVERSITY   (Japan)

^b Korea Electrotechnology Research Institute (KERI)   (South Korea)

^c UNIVERSITY OF TOKYO   (Japan)

Author keywords

Bending behavior; Bi2223 oxide filament; Critical current; Superconducting tape; Tensile behavior

Indexed keywords

BENDING (DEFORMATION); COMPOSITE MATERIALS; COMPRESSIVE STRENGTH; CRITICAL CURRENTS; ELASTIC MODULI; FRACTURE; MAGNESIUM PRINTING PLATES; REDUCTION; SILVER; TENSILE STRENGTH;

BENDING BEHAVIOR; BI2223 OXIDE FILAMENT; SUPERCONDUCTING STRENGTH; TENSILE BEHAVIOR;

BISMUTH;

EID: 9144269123     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.68.681     Document Type: Article

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