Reduction of PFC emissions to the environment through advances in CVD and etch processes

IEEE Transactions on Semiconductor Manufacturing

Volumn 17, Issue 4, 2004, Pages 491-496

  Johnson, Andrew D ^a   Ridgeway, Robert G ^a   Maroulis, Peter J ^a  

^a AIR PRODUCTS AND CHEMICALS INC   (United States)

Author keywords

Chamber clean; Chemical vapor deposition (CVD); Emissions; Perfluorocompound (PFC); Plasma etch

Indexed keywords

FLUORINE COMPOUNDS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLOBAL WARMING; OPTIMIZATION; PARTICULATE EMISSIONS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; SEMICONDUCTOR MATERIALS; THIN FILMS;

CHAMBER CLEAN; ENVIRONMENTAL HEALTH AND SAFETY (EHS); PERFLUOROCOMPOUND (PFC) EMISSIONS; PLASMA ETCH;

ENVIRONMENTAL PROTECTION;

EID: 9144222756     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2004.835700     Document Type: Article

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