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Volumn , Issue , 2003, Pages 9779-9796

Integration of microelectronics-based unit operations into the ChE curriculum

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ENGINEERS; MATERIALS ENGINEERING; MICROELECTRONICS PROCESSING; PLACEMENTS;

EID: 8744318606     PISSN: 01901052     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (24)
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    • (1974) Techniques and Applications of Plasma Chemistry
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    • A continuum model of DC and rf discharges
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    • Graves, D.1    Jensen, K.F.2
  • 8
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    • Transient behavior during film removal in diffusion-controlled plasma etching
    • "Transient Behavior during Film Removal in Diffusion-Controlled Plasma Etching," R.C. Alkire and D.J. Economou, J. Electrochem. Soc. 132, 648 (1985).
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    • Alkire, R.C.1    Economou, D.J.2
  • 10
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    • Modeling and analysis of low pressure CVD reactors
    • "Modeling and Analysis of Low Pressure CVD Reactors," K.F. Jensen and D.B. Graves, J. Electrochem. Soc., 130 1950 (1983).
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    • Jensen, K.F.1    Graves, D.B.2
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    • Roenigk, K.F.1    Jensen, K.F.2
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    • Lubricant retention on a spinning disk
    • "Lubricant Retention on a Spinning Disk," L. Strong and S. Middleman AIChE J. 35 (10), 1753 (1989).
    • (1989) AIChE J. , vol.35 , Issue.10 , pp. 1753
    • Strong, L.1    Middleman, S.2
  • 19
    • 0028444787 scopus 로고
    • Tribology analysis of chemical mechanical polishing
    • "Tribology Analysis of Chemical Mechanical Polishing" S. R. Runnels and L. M. Eyman, J. Electrochem. Soc. 141, 1698 (1994).
    • (1994) J. Electrochem. Soc. , vol.141 , pp. 1698
    • Runnels, S.R.1    Eyman, L.M.2
  • 20
    • 0032730568 scopus 로고    scopus 로고
    • Investigation of the kinetics of tungsten chemical mechanical polishing in iodate based slurries
    • "Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Iodate Based Slurries" D. J. Stein, D. L. Hetherington, and J. L. Cecchi, J. Electrochem. Soc. 146, 376 (1999).
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  • 21
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    • Chemical mechanical polishhing mechanisms of low dielectric constant polymers in copper slurries
    • "Chemical Mechanical Polishhing Mechanisms of Low Dielectric Constant Polymers in Copper Slurries," C.l. Borst, D.G. Thakurta, W.N. Gill, and R.J. Gutmann, J. Electrochem. Soc. 146, 4309 (1999).
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    • Electrochemical effects of various Slurries on the chemical mechanical polishing of copper-plated films
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    • "Electrochemical Effects of Various Slurries on the Chemical Mechanical Polishing of Copper-Plated Films", Tzu-Hsuan Tsai and Shi-Chem Yen, Submitted to J. Electrochem. Soc.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.