Insufficient solder and solder bridges: An experimental study of the interrelations between assembly process faults

Journal of Electronics Manufacturing

Volumn 6, Issue 2, 1996, Pages 93-99

  Choon, Teo Kiat ^a   Williams, David J ^b  

^a Aztech Building   (Singapore)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 8744286609     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S096031319600010X     Document Type: Article

References (7)

1. D. J. Williams, P. P. Conway and D. C. Whalley, "Making circuits more than once: the manufacturing challenges of electronics intensive products", Proc. Inst. Mech. Engrs. 207 (1993) 83-90.
2. K. Oyama, "The trend toward higher pin-counts and narrower pitch", Surface Mount Technology, Recent Japanese Developments, Ed. Jan Vardaman, IEEE Press, 1993, pp. 77-108.
3. T. J. Singler, "Fluid Mechanical Aspect of Soldering Processes", Electronics Packaging Forum, Multichip Module Technology Issues, Ed. J. E. Morris, IEEE Press, 1994, pp. 180-185.
4. D. C. Whalley, "A Model To Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges", J. of Electron. Manuf. 6 (1996) 35-44.
5. P. P. Conway and D. J. Williams, "Experiments to improve the understanding of defects occurring in the reflow soldering of solder paste materials", VDR/ADB, Productronica, 1995, pp. 53-60.
6. K. C. Teo, "The Origin and Prevention of Post Reflow. Defects in Surface Mount Assembly", J. of Electron. Manuf. 6 (1996) 1-12.
7. T. N. Goh, "An Active Approach To Quality Improvement", J. of Industrial Engineers, Singapore 27, (1987) 29-34.