Effect of bond thickness on the fracture toughness of adhesive joints

Journal of Engineering Materials and Technology

Volumn 126, Issue 1, 2004, Pages 14-18

  Lee, Deok Bo ^a   Ikeda, Toru ^b   Miyazaki, Noriyuki ^b   Choi, Nak Sam ^a  

^a Hanyang University   (South Korea)

^b KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BONDING; ELASTOMERS; EPOXY RESINS; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MICROSTRUCTURE; OPTICAL MICROSCOPY; RUBBER;

ADHESIVELY BONDED STRUCTURES; CRACK TIPS;

ADHESIVE JOINTS;

EID: 8744268321     PISSN: 00944289     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1631433     Document Type: Article

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