-
1
-
-
84981774698
-
Peel adhesion. I. some phenomenological aspects of the test
-
Gardon, J. L., 1963, "Peel Adhesion. I. Some Phenomenological Aspects of the Test," J. Appl. Polym. Sci., 7, pp. 625-641.
-
(1963)
J. Appl. Polym. Sci.
, vol.7
, pp. 625-641
-
-
Gardon, J.L.1
-
2
-
-
0015032898
-
Effect of joint geometry on the toughness of epoxy adhesives
-
Mostovoy, S., and Ripling, E. J., 1971, "Effect of Joint Geometry on the Toughness of Epoxy Adhesives," J. Appl. Polym. Sci., 15, pp. 661-673.
-
(1971)
J. Appl. Polym. Sci.
, vol.15
, pp. 661-673
-
-
Mostovoy, S.1
Ripling, E.J.2
-
3
-
-
26544449958
-
The fracture of epoxy and elastomer-modified epoxy polymers in bulk and as adhesives
-
Bascom, W. D., Cottington, R. L., Jones, R. L., and Peyser, P., 1975, "The Fracture of Epoxy and Elastomer-Modified Epoxy Polymers in Bulk and as Adhesives," J. Appl. Polym. Sci., 19, pp. 2545-2562.
-
(1975)
J. Appl. Polym. Sci.
, vol.19
, pp. 2545-2562
-
-
Bascom, W.D.1
Cottington, R.L.2
Jones, R.L.3
Peyser, P.4
-
4
-
-
0016871505
-
Effect of temperature on the adhesive fracture behavior of an elastomer-epoxy resin
-
Bascom, W. D., and Cottington, R. L., 1976, "Effect of Temperature on the Adhesive Fracture Behavior of an Elastomer-Epoxy Resin," J. Adhes., 7, pp. 333-346.
-
(1976)
J. Adhes.
, vol.7
, pp. 333-346
-
-
Bascom, W.D.1
Cottington, R.L.2
-
5
-
-
0019487994
-
The fracture resistance of a toughened epoxy adhesive
-
Kinloch, A. J., and Shaw, S. J., 1981, "The Fracture Resistance of a Toughened Epoxy Adhesive," J. Adhes., 12, pp. 59-77.
-
(1981)
J. Adhes.
, vol.12
, pp. 59-77
-
-
Kinloch, A.J.1
Shaw, S.J.2
-
6
-
-
0000188772
-
Mode I fracture behavior of adhesive joints. Part I. relationship between fracture energy and bond thickness
-
Daghyani, H. R., Ye, L., and Mai, Y. W., 1995, "Mode I Fracture Behavior of Adhesive Joints. Part I. Relationship between Fracture Energy and Bond Thickness," J. Adhes., 53, pp. 149-162.
-
(1995)
J. Adhes.
, vol.53
, pp. 149-162
-
-
Daghyani, H.R.1
Ye, L.2
Mai, Y.W.3
-
7
-
-
0001294565
-
Mode I fracture behavior of adhesive joints. Part II. stress analysis and constraint parameters
-
Daghyani, H. R., Ye, L., and Mai, Y. W., 1995, "Mode I Fracture Behavior of Adhesive Joints. Part II. Stress Analysis and Constraint Parameters," J. Adhes., 53, pp. 163-172.
-
(1995)
J. Adhes.
, vol.53
, pp. 163-172
-
-
Daghyani, H.R.1
Ye, L.2
Mai, Y.W.3
-
8
-
-
0035452125
-
Effects of substrate materials on fracture toughness measurement in adhesive joints
-
Yan, C., Mai, Y. W., Yuan, Q., Ye, L., and Sun, J., 2001, "Effects of Substrate Materials on Fracture Toughness Measurement in Adhesive Joints," Int. J. Mech. Sci., 43, pp. 2091-2102.
-
(2001)
Int. J. Mech. Sci.
, vol.43
, pp. 2091-2102
-
-
Yan, C.1
Mai, Y.W.2
Yuan, Q.3
Ye, L.4
Sun, J.5
-
9
-
-
0036501783
-
Numerical and experimental studies on the fracture behavior of rubber-toughened epoxy in bulk specimen and laminated composites
-
Yan, C., Yiao, K., Ye, L., and Mai, Y. W., 2002, "Numerical and Experimental Studies on the Fracture Behavior of Rubber-Toughened Epoxy in Bulk Specimen and Laminated Composites," J. Mater. Sci., 37, pp. 921-927.
-
(2002)
J. Mater. Sci.
, vol.37
, pp. 921-927
-
-
Yan, C.1
Yiao, K.2
Ye, L.3
Mai, Y.W.4
-
10
-
-
0021505859
-
The characterization of mode I delamination failure in non-woven, multidirectional laminates
-
Chai, H., 1984, "The Characterization of Mode I Delamination Failure in Non-Woven, Multidirectional Laminates," Composites, 15(4), pp. 277-290.
-
(1984)
Composites
, vol.15
, Issue.4
, pp. 277-290
-
-
Chai, H.1
-
11
-
-
0022593898
-
On the correlation between the mode I failure of adhesive joints and laminated composites
-
Chai, H., 1986, "On the Correlation Between the Mode I Failure of Adhesive Joints and Laminated Composites," Eng. Fract. Mech., 24(3), pp. 413-431.
-
(1986)
Eng. Fract. Mech.
, vol.24
, Issue.3
, pp. 413-431
-
-
Chai, H.1
-
12
-
-
0022805999
-
A note on crack trajectory in an elastic strip bounded by rigid substrates
-
Chai, H., 1987, "A Note on Crack Trajectory in an Elastic Strip Bounded by Rigid Substrates," Int. J. Fract., 32, pp. 211-213.
-
(1987)
Int. J. Fract.
, vol.32
, pp. 211-213
-
-
Chai, H.1
-
13
-
-
0002061997
-
Failure of a ductile adhesive layer constrained by hard adherends
-
Ikeda, T., Yamashita, A., Lee, D. B., and Miyazaki, N., 2000, "Failure of a Ductile Adhesive Layer Constrained by Hard Adherends," ASME J. Eng. Mater. Technol., 122(1), pp. 80-85.
-
(2000)
ASME J. Eng. Mater. Technol.
, vol.122
, Issue.1
, pp. 80-85
-
-
Ikeda, T.1
Yamashita, A.2
Lee, D.B.3
Miyazaki, N.4
-
14
-
-
0000344306
-
Ductile failure of a constrained metal foil
-
Varias, A. G., Suo, Z., and Shih, C. F., 1991, "Ductile Failure of a Constrained Metal Foil," J. Mech. Phys. Solids, 39(7), pp. 963-986.
-
(1991)
J. Mech. Phys. Solids
, vol.39
, Issue.7
, pp. 963-986
-
-
Varias, A.G.1
Suo, Z.2
Shih, C.F.3
-
15
-
-
0028444123
-
Cleavage due to dislocation confinement in layered materials
-
Hsia, K. J., Suo, Z., and Yang, W., 1994, "Cleavage due to Dislocation Confinement in Layered Materials," J. Mech. Phys. Solids, 42(6), pp. 877-896.
-
(1994)
J. Mech. Phys. Solids
, vol.42
, Issue.6
, pp. 877-896
-
-
Hsia, K.J.1
Suo, Z.2
Yang, W.3
-
16
-
-
0030141515
-
On the toughness of ductile adhesive joints
-
Tvergaard, V., and Hutchinson, J., 1996, "On the Toughness of Ductile Adhesive Joints," J. Mech. Phys. Solids, 44(5), pp. 789-800.
-
(1996)
J. Mech. Phys. Solids
, vol.44
, Issue.5
, pp. 789-800
-
-
Tvergaard, V.1
Hutchinson, J.2
-
18
-
-
0001004599
-
Grinding and polishing techniques for thin sectioning of polymeric materials for transmission light microscopy
-
Elsevier Publishing Company, New York
-
Holik, A. S., Kambour, R. P., Hobbs, S. Y., and Fink, D. G., 1979, "Grinding and Polishing Techniques for Thin Sectioning of Polymeric Materials for Transmission Light Microscopy," Microstructural Science, Elsevier Publishing Company, New York, 7, pp. 357-367.
-
(1979)
Microstructural Science
, vol.7
, pp. 357-367
-
-
Holik, A.S.1
Kambour, R.P.2
Hobbs, S.Y.3
Fink, D.G.4
-
19
-
-
5844362916
-
Measurement of mixed mode fracture toughness of an interface crack in electronic devices
-
EEP-19-2, ASME, New York
-
Ikeda, T., Komohara Y., and Miyazaki, N., "Measurement of Mixed Mode Fracture Toughness of an Interface Crack in Electronic Devices," Advanced Electronic Packaging, EEP-19-2, ASME, New York, pp. 1437.
-
Advanced Electronic Packaging
, pp. 1437
-
-
Ikeda, T.1
Komohara, Y.2
Miyazaki, N.3
-
20
-
-
0035472615
-
Stress intensity factor analysis for an interface crack between dissimilar isotropic materials under thermal stress
-
Ikeda, T., and Sun, C. T., 2001, "Stress Intensity Factor Analysis for an Interface Crack between Dissimilar Isotropic Materials under Thermal Stress," Int. J. Fract., 111, pp. 229-249.
-
(2001)
Int. J. Fract.
, vol.111
, pp. 229-249
-
-
Ikeda, T.1
Sun, C.T.2
-
21
-
-
0037099436
-
Damage zone around crack tip and fracture toughness of rubber-modified epoxy resin under mixed mode conditions
-
Lee, D. B., Ikeda, T., Miyazaki, N., and Choi, N. S., 2002, "Damage Zone around Crack Tip and Fracture Toughness of Rubber-Modified Epoxy Resin under Mixed Mode Conditions," Eng. Fract. Mech., 69(12), pp. 1363-1375.
-
(2002)
Eng. Fract. Mech.
, vol.69
, Issue.12
, pp. 1363-1375
-
-
Lee, D.B.1
Ikeda, T.2
Miyazaki, N.3
Choi, N.S.4
-
22
-
-
0012390759
-
Damage zone around tip of an interface crack between rubber-modified epoxy resin and aluminum
-
Lee, D. B., Ikeda, T., Miyazaki, N., and Choi, N. S., 2002, "Damage Zone around Tip of an Interface Crack Between Rubber-Modified Epoxy Resin and Aluminum," ASME J. Eng. Mater. Technol., 124(2), pp. 206-214.
-
(2002)
ASME J. Eng. Mater. Technol.
, vol.124
, Issue.2
, pp. 206-214
-
-
Lee, D.B.1
Ikeda, T.2
Miyazaki, N.3
Choi, N.S.4
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